Research output per year
Research output per year
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Dive into the research topics where Brian Foley is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
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Research output
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Steady-state methods for measuring in-plane thermal conductivity of thin films for heat spreading applications
Hines, N. J., Yates, L., Foley, B. M., Cheng, Z., Bougher, T. L., Goorsky, M. S., Hobart, K. D., Feygelson, T. I., Tadjer, M. J. & Graham, S., Apr 1 2021, In: Review of Scientific Instruments. 92, 4, 044907.Research output: Contribution to journal › Article › peer-review
Open Access -
Thermal Conductivity of Aluminum Scandium Nitride for 5G Mobile Applications and beyond
Song, Y., Perez, C., Esteves, G., Lundh, J. S., Saltonstall, C. B., Beechem, T. E., Yang, J. I., Ferri, K., Brown, J. E., Tang, Z., Maria, J. P., Snyder, D. W., Olsson, R. H., Griffin, B. A., Trolier-Mckinstry, S. E., Foley, B. M. & Choi, S., Apr 28 2021, In: ACS Applied Materials and Interfaces. 13, 16, p. 19031-19041 11 p.Research output: Contribution to journal › Article › peer-review
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Achieving Minimal Heat Conductivity by Ballistic Confinement in Phononic Metalattices
Chen, W., Talreja, D., Eichfeld, D., Mahale, P., Nova, N. N., Cheng, H. Y., Russell, J. L., Yu, S. Y., Poilvert, N., Mahan, G., Mohney, S. E., Crespi, V. H., Mallouk, T. E., Badding, J. V., Foley, B., Gopalan, V. & Dabo, I., Apr 28 2020, In: ACS nano. 14, 4, p. 4235-4243 9 p.Research output: Contribution to journal › Article › peer-review
6 Scopus citations -
Characterization of the Thermal Boundary Resistance of a Ga2O3/4H-SiC Composite Wafer
Song, Y., Chatterjee, B., McGray, C., Zhukovsky, S., Leach, J. H., Hess, T., Foley, B. M. & Choi, S., Jul 2020, Proceedings of the 19th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2020. IEEE Computer Society, p. 154-157 4 p. 9190287. (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM; vol. 2020-July).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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Interdependence of Electronic and Thermal Transport in AlxGa1-xN Channel HEMTs
Chatterjee, B., Armstrong, A. M., Klein, B. A., Bansal, A., Seyf, H. R., Talreja, D., Pogrebnyakov, A., Heller, E., Gopalan, V., Henry, A. S., Redwing, J. M., Lundh, J. S., Foley, B., Choi, S., Song, Y., Shoemaker, D., Baca, A. G., Kaplar, R. J., Beechem, T. E., Saltonstall, C. & 1 others, , Mar 2020, In: IEEE Electron Device Letters. 41, 3, p. 461-464 4 p., 8970272.Research output: Contribution to journal › Article › peer-review
3 Scopus citations