Sukwon Choi

Materials Research Institute (MRI)
Assistant Professor, Mechanical Engineering

Source: Scopus
Calculated based on no. of publications stored in Pure and citations from Scopus

Research activity per year

If you made any changes in Pure these will be visible here soon.

Fingerprint

Dive into the research topics where Sukwon Choi is active. These topic labels come from the works of this person. Together they form a unique fingerprint.

4 Similar Profiles

Network

Recent external collaboration on country level. Dive into details by clicking on the dots.

464 Citations
12 h-Index
33 Article
10 Conference contribution
1 Chapter
1 Paper

2D Materials for Universal Thermal Imaging of Micro- and Nanodevices: An Application to Gallium Oxide Electronics
Lundh, J. S., Zhang, T., Zhang, Y., Xia, Z., Wetherington, M., Lei, Y., Kahn, E., Rajan, S., Terrones, M. & Choi, S., Sep 22 2020, In: ACS Applied Electronic Materials. 2, 9, p. 2945-2953 9 p.
Research output: Contribution to journal › Article › peer-review
Characterization of the Interdependence between the Light Output and Self-Heating of Gallium Nitride Light-Emitting Diodes
Chatterjee, B., Lundh, J. S., Shoemaker, D., Kim, T. K., Kim, H., Giebnik, N. C., Kwak, J. S., Cho, J. & Choi, S., Sep 1 2020, In: Journal of Electronic Packaging, Transactions of the ASME. 142, 3, 031111.
Research output: Contribution to journal › Article › peer-review
Characterization of the Thermal Boundary Resistance of a Ga₂O₃/4H-SiC Composite Wafer
Song, Y., Chatterjee, B., McGray, C., Zhukovsky, S., Leach, J. H., Hess, T., Foley, B. M. & Choi, S., Jul 2020, Proceedings of the 19th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2020. IEEE Computer Society, p. 154-157 4 p. 9190287. (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM; vol. 2020-July).
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Device-Level Multidimensional Thermal Dynamics with Implications for Current and Future Wide Bandgap Electronics
Lundh, J. S., Song, Y., Chatterjee, B., Baca, A. G., Kaplar, R. J., Armstrong, A. M., Allerman, A. A., Klein, B. A., Kendig, D., Kim, H. & Choi, S., Sep 1 2020, In: Journal of Electronic Packaging, Transactions of the ASME. 142, 3, 031113.
Research output: Contribution to journal › Article › peer-review
2 Scopus citations
Electro-thermal co-design of β -(Al_xGa_1-x)₂O₃/Ga₂O₃modulation doped field effect transistors
Chatterjee, B., Song, Y., Lundh, J. S., Zhang, Y., Xia, Z., Islam, Z., Leach, J., McGray, C., Ranga, P., Krishnamoorthy, S., Haque, A., Rajan, S. & Choi, S., Oct 12 2020, In: Applied Physics Letters. 117, 15, 153501.
Research output: Contribution to journal › Article › peer-review
1 Scopus citations

2D Materials for Universal Thermal Imaging of Micro- and Nanodevices: An Application to Gallium Oxide Electronics

Characterization of the Interdependence between the Light Output and Self-Heating of Gallium Nitride Light-Emitting Diodes

Characterization of the Thermal Boundary Resistance of a Ga2O3/4H-SiC Composite Wafer

Device-Level Multidimensional Thermal Dynamics with Implications for Current and Future Wide Bandgap Electronics

Electro-thermal co-design of β -(AlxGa1-x)2O3/Ga2O3modulation doped field effect transistors

Characterization of the Thermal Boundary Resistance of a Ga₂O₃/4H-SiC Composite Wafer

Electro-thermal co-design of β -(Al_xGa_1-x)₂O₃/Ga₂O₃modulation doped field effect transistors