This letter reports a GaN vertical trench metal-oxide-semiconductor field-effect transistor (MOSFET) with normally-off operation. Selective area regrowth of n+- GaN source layer was performed to avoid plasma etch damage to the p-GaN body contact region. A metal-organic-chemicalvapor- deposition (MOCVD) grown AlN/SiN dielectric stack was employed as the gate "oxide". This unique process yielded a 0.5-mm2-active-area transistor with threshold voltage of 4.8 V, blocking voltage of 600 V at gate bias of 0 V, and on-resistance of 1.7 Ω at gate bias of 10 V.
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering