A characteristic of scattering patterns from defect in a rail

Chong Myoung Lee, Joseph L. Rose, Younho Cho

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

Rail represents one of the most important means of transportation. Many nondestructive testing methods have been used to find defects in rail. The guided wave technique is the most efficient because of its long propagation characteristic along the rail. The wave structure of the rail cross-section for a particular loading condition of modes and frequencies is an important feature. The wave structures are examined at different modes and frequencies. The propagation scattering patterns of guided waves from various multiple defects in a rail are also studied using finite element method.

Original languageEnglish (US)
Pages (from-to)788-791
Number of pages4
JournalKey Engineering Materials
Volume321-323 I
StatePublished - Oct 12 2006

Fingerprint

Rails
Scattering
Defects
Guided electromagnetic wave propagation
Nondestructive examination
Finite element method

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Lee, C. M., Rose, J. L., & Cho, Y. (2006). A characteristic of scattering patterns from defect in a rail. Key Engineering Materials, 321-323 I, 788-791.
Lee, Chong Myoung ; Rose, Joseph L. ; Cho, Younho. / A characteristic of scattering patterns from defect in a rail. In: Key Engineering Materials. 2006 ; Vol. 321-323 I. pp. 788-791.
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Lee, CM, Rose, JL & Cho, Y 2006, 'A characteristic of scattering patterns from defect in a rail', Key Engineering Materials, vol. 321-323 I, pp. 788-791.

A characteristic of scattering patterns from defect in a rail. / Lee, Chong Myoung; Rose, Joseph L.; Cho, Younho.

In: Key Engineering Materials, Vol. 321-323 I, 12.10.2006, p. 788-791.

Research output: Contribution to journalArticle

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Lee CM, Rose JL, Cho Y. A characteristic of scattering patterns from defect in a rail. Key Engineering Materials. 2006 Oct 12;321-323 I:788-791.