A modified inductively coupled plasma for high-speed, ultra-smooth reactive phase etching of silica glass

C. Zhang, G. Hatipoglu, Srinivas A. Tadigadapa

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

We report on the etching of borosilicate glass substrates in a conventional and modified inductively coupled plasma - reactive ion etch (ICP-RIE) tool. We present the etch rates and surface roughness of borosilicate glass in various fluorine based plasmas using C4F8, SF6, Ar, NF3, and H2O gases. In the conventional ICP-RIE etching mode an etch rate of 0.55 μm/min at a rms surface roughness of 25 nm was obtained at C4F8, SF6 flow rates of 5 sccm, O2 flow rate of 50 sccm, 2000 W of ICP power, 475 W of substrate power. A maximum etch rate of 0.67μm/min was obtained at a high rms surface roughness of 450 nm by increasing flow rate of C4F8 to 50 sccm. Using the modified ICP-RIE system consisting of a gas diffuser ring clamped to the substrate holder, the physical component of the etching was considerably reduced and we have been able to achieve etch rates ∼0.72 μm/min with surface smoothness of ∼1 nm for borosilicate glass and fused silica respectively after 5 minutes etches.

Original languageEnglish (US)
Title of host publication2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages592-595
Number of pages4
ISBN (Electronic)9781479989553
DOIs
StatePublished - Aug 5 2015
Event18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015 - Anchorage, United States
Duration: Jun 21 2015Jun 25 2015

Publication series

Name2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015

Other

Other18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015
CountryUnited States
CityAnchorage
Period6/21/156/25/15

All Science Journal Classification (ASJC) codes

  • Instrumentation
  • Electrical and Electronic Engineering

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