A novel technique for Interfacial Thermal Resistance measurement for nanoscale thin films

R. A. Pulavarthy, M. A. Haque

Research output: Contribution to journalArticlepeer-review

3 Scopus citations

Abstract

Abstract Thermal resistance of interfaces is one of the most challenging measurands in experimental heat transfer, particularly for micro and nanoscale thin films. It is also the dominating quantity in thermal management in microelectronic and energy conversion devices. We present a novel technique that exploits the size dependence of thermal resistance in thin films to magnify the discontinuous temperature drop at the interface, which is then measured with infrared thermometry. We show that orders of magnitude amplification in interfacial temperature drop is possible by making the specimen freestanding, which facilitates the measurement. We present experimental results on metal-dielectric interfaces involving aluminum, copper, silicon di-oxide and hafnium oxide for validation of the novel technique.

Original languageEnglish (US)
Article number12096
Pages (from-to)743-748
Number of pages6
JournalInternational Journal of Heat and Mass Transfer
Volume89
DOIs
StatePublished - Jun 15 2015

All Science Journal Classification (ASJC) codes

  • Condensed Matter Physics
  • Mechanical Engineering
  • Fluid Flow and Transfer Processes

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