Abstract
A-Si:H thin film transistors (TFT) phosphorescent organic light emitting diode (OLED) active matrix pixels and pixel array were fabricated on 50μm thick polyimide substrates. 4-inch polymeric substrates were laminated to glass plates using a removal pressure-sensitive silicone gel adhesive to improve thermal coupling, maintain a flat surface, and provide rigid support during processing. A inverted staggered tri-layer a-Si:H process with a maximum process temperature of 250 °C and conservative 15 μm layout rules was used for pixel fabrication. The results show that the backplane fabricated on polyimide and an optical microscope image is complete of a portion of an array before OLED.
Original language | English (US) |
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Title of host publication | Device Research Conference - Conference Digest, 62nd DRC |
Pages | 59-60 |
Number of pages | 2 |
DOIs | |
State | Published - Dec 1 2004 |
Event | Device Research Conference - Conference Digest, 62nd DRC - Notre Dame, IN, United States Duration: Jun 21 2004 → Jun 23 2004 |
Other
Other | Device Research Conference - Conference Digest, 62nd DRC |
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Country/Territory | United States |
City | Notre Dame, IN |
Period | 6/21/04 → 6/23/04 |
All Science Journal Classification (ASJC) codes
- Engineering(all)