A study of material removal rates for shallow drilling with an ultrashort pulse laser

B. R. Campbell, L. A. Forster, J. A. Moore, T. M. Lehecka, J. G. Thomas, V. V. Semak

Research output: Contribution to journalConference article

1 Scopus citations

Abstract

Using a commercial laser system operating at a 532 nm wavelength with 10 ps pulses, experiments were conducted on polished metal samples to study material removal characteristics from a low number of laser pulse exposures. The samples were analyzed with a scanning electron microscope and white light interferometer to gather data on surface deformation and material removal. The effects of energy and various double pulse machining methods were examined. The results from changing the pulse separation for double pulse drilling are compared to prior work with picosecond and nanosecond pulse lasers.

Original languageEnglish (US)
Article number72010I
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume7201
DOIs
StatePublished - May 27 2009
EventLaser Applications in Microelectronic and Optoelectronic Manufacturing VII - San Jose, CA, United States
Duration: Jan 26 2009Jan 29 2009

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All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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