A transverse-wave ultrasonic oblique-incidence technique for interfacial weakness detection in adhesive bonds

Aleksander Pilarski, Joseph L. Rose

Research output: Contribution to journalArticle

117 Citations (Scopus)

Abstract

The possibility of using an ultrasonic oblique-incidence technique for improved sensitivity in interfacial weakness detection in adhesive bonds was considered. The analysis of the sensitivity of transverse waves to interface imperfections on an interface between two semi-infinite half-spaces with bond rigidities of various finite values was carried out. Excellent sensitivity is obtained for discriminating bond weaknesses from a perfect or welded situation to a poor or smooth situation compared to longitudinal wave impingement and reflection. The optimal angle of incidence for the inspection of an aluminum-to-aluminum adhesively bonded structure in an immersion technique is presented. Additionally, a signal feature in frequency domain for adhesive and cohesive weakness distinction is proposed.

Original languageEnglish (US)
Pages (from-to)300-307
Number of pages8
JournalJournal of Applied Physics
Volume63
Issue number2
DOIs
StatePublished - Dec 1 1988

Fingerprint

transverse waves
adhesives
incidence
ultrasonics
sensitivity
aluminum
impingement
longitudinal waves
half spaces
rigidity
submerging
inspection
defects

All Science Journal Classification (ASJC) codes

  • Physics and Astronomy(all)

Cite this

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A transverse-wave ultrasonic oblique-incidence technique for interfacial weakness detection in adhesive bonds. / Pilarski, Aleksander; Rose, Joseph L.

In: Journal of Applied Physics, Vol. 63, No. 2, 01.12.1988, p. 300-307.

Research output: Contribution to journalArticle

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