Acoustic evaluation of the integrity of thin film structures

J. Du, B. R. Tittmann

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper explores the potential offered by high frequency acoustic microscopy for nondestructive, qualitative and quantitative characterization of thin (micron and submicron) films. Wave propagation modeling in soft thin film samples shows that multiple modes of surface waves can exist in soft thin film structures. Interface weakness modeling indicates that surface wave velocities are sensitive to interface conditions and that different modes have different levels of sensitivity to bond strength. Our new acoustic microscope experimental system will be able to measure experimental dispersion curves, and measure the surface wave velocity as a function of frequency.

Original languageEnglish (US)
Title of host publicationReview of Progress in Quantitative Nondestructive Evaluation
Subtitle of host publicationVolume 25B
Pages1090-1097
Number of pages8
DOIs
StatePublished - Mar 6 2006
EventReview of Progress in Quantitative Nondestructive - Brunswick, ME, United States
Duration: Jul 31 2005Aug 5 2005

Publication series

NameAIP Conference Proceedings
Volume820 II
ISSN (Print)0094-243X
ISSN (Electronic)1551-7616

Other

OtherReview of Progress in Quantitative Nondestructive
CountryUnited States
CityBrunswick, ME
Period7/31/058/5/05

All Science Journal Classification (ASJC) codes

  • Physics and Astronomy(all)

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  • Cite this

    Du, J., & Tittmann, B. R. (2006). Acoustic evaluation of the integrity of thin film structures. In Review of Progress in Quantitative Nondestructive Evaluation: Volume 25B (pp. 1090-1097). (AIP Conference Proceedings; Vol. 820 II). https://doi.org/10.1063/1.2184646