Advanced packaging automation for opto-electronic systems

Shubham K. Bhat, Timothy Kurzweg, Allon Guez

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this paper, we present a learning control algorithm used in our research of advanced opto-electronic automation, which yields high performance, low cost opto-electronic alignment and packaging through the use of intelligent control theory and system-level modeling. The learning loop technique is activated at a lower sampling frequency for specific and appropriate tasks, to improve the knowledge based control model. Our automation technique is based on constructing an a priori knowledge based model, specific to the assembled package's optical power propagation characteristics. From this model, a piece-wise linear inverse model is created and used in the "feed-forward" loop. This model can be updated for increased accuracy through the learning loop.

Original languageEnglish (US)
Title of host publication2004 1st IEEE Lightwave Technologies in Instrumentation and Measurement Conference
Pages11-16
Number of pages6
StatePublished - Dec 1 2004
Event2004 1st IEEE Lightwave Technologies in Instrumentation and Measurement Conference - Palisades, NY, United States
Duration: Oct 19 2004Oct 20 2004

Publication series

Name2004 1st IEEE Lightwave Technologies in Instrumentation and Measurement Conference

Conference

Conference2004 1st IEEE Lightwave Technologies in Instrumentation and Measurement Conference
CountryUnited States
CityPalisades, NY
Period10/19/0410/20/04

All Science Journal Classification (ASJC) codes

  • Engineering(all)

Fingerprint Dive into the research topics of 'Advanced packaging automation for opto-electronic systems'. Together they form a unique fingerprint.

  • Cite this

    Bhat, S. K., Kurzweg, T., & Guez, A. (2004). Advanced packaging automation for opto-electronic systems. In 2004 1st IEEE Lightwave Technologies in Instrumentation and Measurement Conference (pp. 11-16). (2004 1st IEEE Lightwave Technologies in Instrumentation and Measurement Conference).