Agaricus bisporus grain spawn substrate with S41 and S44 nutrient supplements

Mark A. Bechara, Paul Heinz Heinemann, Paul N. Walker, Charles P. Romaine

Research output: Contribution to conferencePaper

3 Scopus citations


A substrate predominantly composed of mushroom grain spawn and nutrient supplements was tested for Agaricus mushroom productivity with the goal of eliminating composting from mushroom production. Different rates of S41 and S44 mushroom nutrient supplements mixed with grain spawn were used (20%, 15%, 10%, 5%, 1%, and 0%). Two casing treatment were tested for mushroom yield; a non-sterile and a sterile casing with 25% activated carbon. Thiophanate methyl was used in one set of treatments to control the incidence of fungal contamination, whereas another set of treatments had no thiophanate methyl. The results show that mushroom yield from a nonsterile casing overlain on a 10%S41 grain spawn substrate was statistically comparable(p<0.05) to the same substrate with a sterile casing with 25% activated carbon, 6.4 kg/m2 and 8.6 kg/m2, respectively. Adding thiophanate methyl lowered the yield for both S41 and S44 (p<0.05). The S41 supplement on average produced greater mushroom yield compared to S44 (p<0.04). When perlite was added to the substrate as a water-holding material, the yield was increased greatly, producing 13kg/m2 compared to 7.5 kg/m2 for the treatment without perlite (p<0.05).

Original languageEnglish (US)
Publication statusPublished - Dec 1 2005
Event2005 ASAE Annual International Meeting - Tampa, FL, United States
Duration: Jul 17 2005Jul 20 2005


Other2005 ASAE Annual International Meeting
CountryUnited States
CityTampa, FL


All Science Journal Classification (ASJC) codes

  • Agricultural and Biological Sciences(all)
  • Bioengineering

Cite this

Bechara, M. A., Heinemann, P. H., Walker, P. N., & Romaine, C. P. (2005). Agaricus bisporus grain spawn substrate with S41 and S44 nutrient supplements. Paper presented at 2005 ASAE Annual International Meeting, Tampa, FL, United States.