An analytical model of strain isolation for stretchable and flexible electronics

H. Cheng, J. Wu, M. Li, D. H. Kim, Y. S. Kim, Y. Huang, Z. Kang, K. C. Hwang, J. A. Rogers

Research output: Contribution to journalArticlepeer-review

33 Scopus citations

Abstract

One important aspect of stretchable electronics design is to shield the active devices from strains through insertion of a soft layer between devices and substrate. An analytical model is established, which gives linear dependence of strain isolation on the reciprocal of strain-isolation layer thickness, and the reciprocal of device and substrate stiffness. Strain isolation is also linearly proportional to the shear modulus of strain-isolation layer and square of device length.

Original languageEnglish (US)
Article number061902
JournalApplied Physics Letters
Volume98
Issue number6
DOIs
StatePublished - Feb 7 2011

All Science Journal Classification (ASJC) codes

  • Physics and Astronomy (miscellaneous)

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