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An epoxy bonding apparatus for applications under extreme environment
Runkun Jiang, Lei Mei,
Q. M. Zhang
Electrical Engineering
Research output
:
Contribution to journal
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Article
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peer-review
1
Scopus citations
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Dive into the research topics of 'An epoxy bonding apparatus for applications under extreme environment'. Together they form a unique fingerprint.
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Weight
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Chemical Compounds
Strength
100%
Environment
89%
Vacuum
78%
Epoxy Resin
57%
Application
49%
Pressure
34%
Packaging Material
24%
Bubble
20%
Surface
18%
Leaf Like Crystal
16%
Ceramic
15%
Glass
13%
Physics & Astronomy
epoxy resins
39%
air
36%
vacuum
30%
drilling
27%
spacers
25%
oils
21%
transducers
19%
high temperature tests
18%
ketones
15%
releasing
14%
vacuum systems
14%
acoustics
13%
piezoelectric ceramics
13%
ethers
13%
reinforcement
12%
packaging
12%
leaves
12%
fiber optics
10%
bubbles
9%
preparation
8%
vibration
7%
glass
6%
fibers
6%
temperature
3%
Engineering & Materials Science
Vacuum
53%
Epoxy resins
38%
Acoustic transducers
37%
Air
33%
Drilling
20%
Piezoelectric ceramics
16%
Polyether ether ketones
16%
Packaging materials
16%
Oils
15%
Temperature
14%
Computer control
14%
Fiber reinforced materials
12%
Fiber optics
12%
Strength of materials
12%
Glass fibers
11%
Glass
9%
Experiments
4%