An improved phase de-embedding technique for high speed connectors

Doug Campbell, Aldo Morales, Sedig Agili

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

As high-speed data applications, such as USB 3.0, are coming down to the consumer electronic world, there is a need of accurate methods to characterize channel behavior. This paper investigates further S-parameter phase errors when de-embedding a device under test (DUT) from onboard structures. A fixture model containing a DUT is constructed enabling the determination of the de-embedding solutions. From these solutions, new equations for DUT Sparameter phase sensitivity are developed. The improved method enables accurate de-embedding of the phase of highspeed connectors used in consumer electronics hardware.

Original languageEnglish (US)
Title of host publicationICCE 2010 - 2010 Digest of Technical Papers International Conference on Consumer Electronics
Pages211-212
Number of pages2
DOIs
StatePublished - Apr 1 2010
Event2010 International Conference on Consumer Electronics, ICCE 2010 - Las Vegas, NV, United States
Duration: Jan 11 2010Jan 13 2010

Publication series

NameICCE 2010 - 2010 Digest of Technical Papers International Conference on Consumer Electronics

Other

Other2010 International Conference on Consumer Electronics, ICCE 2010
CountryUnited States
CityLas Vegas, NV
Period1/11/101/13/10

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

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  • Cite this

    Campbell, D., Morales, A., & Agili, S. (2010). An improved phase de-embedding technique for high speed connectors. In ICCE 2010 - 2010 Digest of Technical Papers International Conference on Consumer Electronics (pp. 211-212). [5419022] (ICCE 2010 - 2010 Digest of Technical Papers International Conference on Consumer Electronics). https://doi.org/10.1109/ICCE.2010.5419022