An improved phase de-embedding technique for high speed connectors

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

As high-speed data applications, such as USB 3.0, are coming down to the consumer electronic world, there is a need of accurate methods to characterize channel behavior. This paper investigates further S-parameter phase errors when de-embedding a device under test (DUT) from onboard structures. A fixture model containing a DUT is constructed enabling the determination of the de-embedding solutions. From these solutions, new equations for DUT Sparameter phase sensitivity are developed. The improved method enables accurate de-embedding of the phase of highspeed connectors used in consumer electronics hardware.

Original languageEnglish (US)
Title of host publicationICCE 2010 - 2010 Digest of Technical Papers International Conference on Consumer Electronics
Pages211-212
Number of pages2
DOIs
StatePublished - Apr 1 2010
Event2010 International Conference on Consumer Electronics, ICCE 2010 - Las Vegas, NV, United States
Duration: Jan 11 2010Jan 13 2010

Other

Other2010 International Conference on Consumer Electronics, ICCE 2010
CountryUnited States
CityLas Vegas, NV
Period1/11/101/13/10

Fingerprint

Consumer electronics
Scattering parameters
Hardware

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

Cite this

Campbell, D., Morales, A. W., & Agili, S. S. (2010). An improved phase de-embedding technique for high speed connectors. In ICCE 2010 - 2010 Digest of Technical Papers International Conference on Consumer Electronics (pp. 211-212). [5419022] https://doi.org/10.1109/ICCE.2010.5419022
Campbell, Doug ; Morales, Aldo W. ; Agili, Sedig Salem. / An improved phase de-embedding technique for high speed connectors. ICCE 2010 - 2010 Digest of Technical Papers International Conference on Consumer Electronics. 2010. pp. 211-212
@inproceedings{e5c5d93832514439b01b2254c21864a1,
title = "An improved phase de-embedding technique for high speed connectors",
abstract = "As high-speed data applications, such as USB 3.0, are coming down to the consumer electronic world, there is a need of accurate methods to characterize channel behavior. This paper investigates further S-parameter phase errors when de-embedding a device under test (DUT) from onboard structures. A fixture model containing a DUT is constructed enabling the determination of the de-embedding solutions. From these solutions, new equations for DUT Sparameter phase sensitivity are developed. The improved method enables accurate de-embedding of the phase of highspeed connectors used in consumer electronics hardware.",
author = "Doug Campbell and Morales, {Aldo W.} and Agili, {Sedig Salem}",
year = "2010",
month = "4",
day = "1",
doi = "10.1109/ICCE.2010.5419022",
language = "English (US)",
isbn = "9781424443161",
pages = "211--212",
booktitle = "ICCE 2010 - 2010 Digest of Technical Papers International Conference on Consumer Electronics",

}

Campbell, D, Morales, AW & Agili, SS 2010, An improved phase de-embedding technique for high speed connectors. in ICCE 2010 - 2010 Digest of Technical Papers International Conference on Consumer Electronics., 5419022, pp. 211-212, 2010 International Conference on Consumer Electronics, ICCE 2010, Las Vegas, NV, United States, 1/11/10. https://doi.org/10.1109/ICCE.2010.5419022

An improved phase de-embedding technique for high speed connectors. / Campbell, Doug; Morales, Aldo W.; Agili, Sedig Salem.

ICCE 2010 - 2010 Digest of Technical Papers International Conference on Consumer Electronics. 2010. p. 211-212 5419022.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

TY - GEN

T1 - An improved phase de-embedding technique for high speed connectors

AU - Campbell, Doug

AU - Morales, Aldo W.

AU - Agili, Sedig Salem

PY - 2010/4/1

Y1 - 2010/4/1

N2 - As high-speed data applications, such as USB 3.0, are coming down to the consumer electronic world, there is a need of accurate methods to characterize channel behavior. This paper investigates further S-parameter phase errors when de-embedding a device under test (DUT) from onboard structures. A fixture model containing a DUT is constructed enabling the determination of the de-embedding solutions. From these solutions, new equations for DUT Sparameter phase sensitivity are developed. The improved method enables accurate de-embedding of the phase of highspeed connectors used in consumer electronics hardware.

AB - As high-speed data applications, such as USB 3.0, are coming down to the consumer electronic world, there is a need of accurate methods to characterize channel behavior. This paper investigates further S-parameter phase errors when de-embedding a device under test (DUT) from onboard structures. A fixture model containing a DUT is constructed enabling the determination of the de-embedding solutions. From these solutions, new equations for DUT Sparameter phase sensitivity are developed. The improved method enables accurate de-embedding of the phase of highspeed connectors used in consumer electronics hardware.

UR - http://www.scopus.com/inward/record.url?scp=77950129426&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=77950129426&partnerID=8YFLogxK

U2 - 10.1109/ICCE.2010.5419022

DO - 10.1109/ICCE.2010.5419022

M3 - Conference contribution

AN - SCOPUS:77950129426

SN - 9781424443161

SP - 211

EP - 212

BT - ICCE 2010 - 2010 Digest of Technical Papers International Conference on Consumer Electronics

ER -

Campbell D, Morales AW, Agili SS. An improved phase de-embedding technique for high speed connectors. In ICCE 2010 - 2010 Digest of Technical Papers International Conference on Consumer Electronics. 2010. p. 211-212. 5419022 https://doi.org/10.1109/ICCE.2010.5419022