An investigation on the students' perception of dissection effectiveness in a redesign context

Gül E. Okudan, Susan Mohammed

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Disassemble/Analyze/Assemble (DAA) activities involve the disassembly, analysis, and assembly of an artifact. Such activities are frequently made a part of the undergraduate engineering curricula in the United States (and elsewhere) as they provide useful 'hands-on' active learning components that can be easily integrated into various courses. DAA activities are central to product dissection and reverse engineering, terms which have been used interchangeably in the engineering design education literature and course titles. In some cases these activities are coupled with redesign activities, paving the way for a good context and providing a background for a meaningful engineering design. Despite this fact, however, based on our review of the literature it is not clear how do these DAA activities help with the redesign activity, if at all. Accordingly, in this paper we present results of our data collection that aimed at uncovering students' perception regarding if DAA activities help with redesign (e.g., is it easier to redesign after dissection?). Overall, students had positive perceptions toward dissection, specifically with regards to its impact on redesign. We also report on the relation of student perceptions to design task, team functioning, and tolerance for ambiguity.

Original languageEnglish (US)
Title of host publication2008 Proceedings of the ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, DETC 2008
Pages395-401
Number of pages7
Volume5
StatePublished - 2009
Event2008 ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, DETC 2008 - New York City, NY, United States
Duration: Aug 3 2008Aug 6 2008

Other

Other2008 ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, DETC 2008
CountryUnited States
CityNew York City, NY
Period8/3/088/6/08

Fingerprint

Dissection
Students
Reverse engineering
Curricula
Education

All Science Journal Classification (ASJC) codes

  • Artificial Intelligence
  • Computational Theory and Mathematics
  • Industrial and Manufacturing Engineering
  • Mechanical Engineering

Cite this

Okudan, G. E., & Mohammed, S. (2009). An investigation on the students' perception of dissection effectiveness in a redesign context. In 2008 Proceedings of the ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, DETC 2008 (Vol. 5, pp. 395-401)
Okudan, Gül E. ; Mohammed, Susan. / An investigation on the students' perception of dissection effectiveness in a redesign context. 2008 Proceedings of the ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, DETC 2008. Vol. 5 2009. pp. 395-401
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Okudan, GE & Mohammed, S 2009, An investigation on the students' perception of dissection effectiveness in a redesign context. in 2008 Proceedings of the ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, DETC 2008. vol. 5, pp. 395-401, 2008 ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, DETC 2008, New York City, NY, United States, 8/3/08.

An investigation on the students' perception of dissection effectiveness in a redesign context. / Okudan, Gül E.; Mohammed, Susan.

2008 Proceedings of the ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, DETC 2008. Vol. 5 2009. p. 395-401.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Okudan GE, Mohammed S. An investigation on the students' perception of dissection effectiveness in a redesign context. In 2008 Proceedings of the ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, DETC 2008. Vol. 5. 2009. p. 395-401