Application of a high numerical aperture lens to visualize disbonding between metallic films and polymer substrates with SAM

Steven E. Owens, Chiaki Miyasaka, Peter J. Shull

Research output: Contribution to journalConference article

Abstract

Due to increased demand for design flexibility, in recent years engineers have progressively employed polymers in the design of electronics enclosures. As the circuits in these enclosures are miniaturized, dissipate more thermal energy and run at higher clock speeds, electromagnetic interference (EMI) and heat dissipation concerns become more apparent and are more problematic. The high thermal impedance of polymers slows their implementation in these situations. In addition, many electronics devices are subject to industrial and governmental regulations for EMI emission and isolation. To address these concerns it is becoming increasingly popular to apply conformal metallic films to polymer-based enclosures to increase EMI shielding and decrease thermal impedance through heat spreading. As with any coating, quality assurance of adhesion between the film and substrate is of immense importance. Without standardized testing procedures for assuring the quality of these processes, it is difficult to place them into practice. When new and alternative manufacturing processes are brought forth quality assurance is of paramount importance. The majority of existing commercial testing procedures for determination of adhesion quality for metallic films pertain to metallic substrates. This paper presents the application of a practical shear wave lens to overcome these issues. It will be demonstrated that the shear wave lens will provide sufficient resolution in this application to allow visualization of bond quality and determination of to what degree a conformal coating has been achieved.

Original languageEnglish (US)
Pages (from-to)50-54
Number of pages5
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume5393
DOIs
StatePublished - Oct 25 2004
EventNondestructive Evaluation and Health Monitoring of Aerospace Materials and Composites III - San Diego, CA, United States
Duration: Mar 16 2004Mar 17 2004

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All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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