Engineering & Materials Science
Transmission electron microscopy
89%
Thin films
82%
MEMS
80%
Scanning electron microscopy
68%
Yield stress
52%
Aluminum
44%
Sensors
44%
Microfabrication
36%
Tensile testing
33%
Strain hardening
29%
Multilayers
28%
Creep
24%
Elastic moduli
24%
Silicon
22%
Experiments
20%
Substrates
20%
Testing
14%
Chemical Compounds
Yield Point
100%
Strain Hardening
60%
Force
58%
Creep
53%
Size Effect
49%
Grain Size
40%
Multilayer
38%
Strain
30%
Application
27%
Purity
21%
Time
15%
Physics & Astronomy
microelectromechanical systems
84%
scanning electron microscopy
56%
sensors
53%
characterization
48%
thin films
44%
aluminum
29%
strain hardening
24%
yield strength
22%
modulus of elasticity
17%
chambers
17%
alignment
16%
grain size
16%
silicon
11%