Application of Scanning Acoustic Microscopy to Electric and Electronic Parts

C. Miyasaka, B. R. Tittmann

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Ever since the invention of the scanning acoustic microscope (SAM), a key objective has been the enhancement of the resolution in an interior image. Thus, an acoustic lens that can form an interior image with a shear wave has been designed. The use of this lens gives benefits such as an increase of lateral resolution in the interior image, a reduction in background noise caused by surface roughness, and a reduction of spherical aberration. Significantly, with the current trend towards microminiaturization of microelectronic packages, acoustic microscopy with higher resolution and removal of surface roughness can play an important role in diagnostic examinations and failure analysis. In this paper, applications for the lens in microelectronic IC packages will be summarized.

Original languageEnglish (US)
Title of host publicationConference Proceedings from the International Symposium for Testing and Failure Analysis
Pages303-306
Number of pages4
StatePublished - 2000
EventProceedings of the 26th International Symposium for Testing and Failure Analysis - Bellevue, WA, United States
Duration: Nov 12 2000Nov 16 2000

Other

OtherProceedings of the 26th International Symposium for Testing and Failure Analysis
CountryUnited States
CityBellevue, WA
Period11/12/0011/16/00

Fingerprint

Microelectronics
Lenses
Surface roughness
Acoustic microscopes
Acoustic imaging
Shear waves
Patents and inventions
Aberrations
Failure analysis
Scanning
Acoustic Microscopy

All Science Journal Classification (ASJC) codes

  • Safety, Risk, Reliability and Quality

Cite this

Miyasaka, C., & Tittmann, B. R. (2000). Application of Scanning Acoustic Microscopy to Electric and Electronic Parts. In Conference Proceedings from the International Symposium for Testing and Failure Analysis (pp. 303-306)
Miyasaka, C. ; Tittmann, B. R. / Application of Scanning Acoustic Microscopy to Electric and Electronic Parts. Conference Proceedings from the International Symposium for Testing and Failure Analysis. 2000. pp. 303-306
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Miyasaka, C & Tittmann, BR 2000, Application of Scanning Acoustic Microscopy to Electric and Electronic Parts. in Conference Proceedings from the International Symposium for Testing and Failure Analysis. pp. 303-306, Proceedings of the 26th International Symposium for Testing and Failure Analysis, Bellevue, WA, United States, 11/12/00.

Application of Scanning Acoustic Microscopy to Electric and Electronic Parts. / Miyasaka, C.; Tittmann, B. R.

Conference Proceedings from the International Symposium for Testing and Failure Analysis. 2000. p. 303-306.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Miyasaka C, Tittmann BR. Application of Scanning Acoustic Microscopy to Electric and Electronic Parts. In Conference Proceedings from the International Symposium for Testing and Failure Analysis. 2000. p. 303-306