Abstract
Ever since the invention of the scanning acoustic microscope (SAM), a key objective has been the enhancement of the resolution in an interior image. Thus, an acoustic lens that can form an interior image with a shear wave has been designed. The use of this lens gives benefits such as an increase of lateral resolution in the interior image, a reduction in background noise caused by surface roughness, and a reduction of spherical aberration. Significantly, with the current trend towards microminiaturization of microelectronic packages, acoustic microscopy with higher resolution and removal of surface roughness can play an important role in diagnostic examinations and failure analysis. In this paper, applications for the lens in microelectronic IC packages will be summarized.
| Original language | English (US) |
|---|---|
| Title of host publication | Conference Proceedings from the International Symposium for Testing and Failure Analysis |
| Pages | 303-306 |
| Number of pages | 4 |
| State | Published - 2000 |
| Event | Proceedings of the 26th International Symposium for Testing and Failure Analysis - Bellevue, WA, United States Duration: Nov 12 2000 → Nov 16 2000 |
Other
| Other | Proceedings of the 26th International Symposium for Testing and Failure Analysis |
|---|---|
| Country | United States |
| City | Bellevue, WA |
| Period | 11/12/00 → 11/16/00 |
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All Science Journal Classification (ASJC) codes
- Safety, Risk, Reliability and Quality
Cite this
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Application of Scanning Acoustic Microscopy to Electric and Electronic Parts. / Miyasaka, C.; Tittmann, B. R.
Conference Proceedings from the International Symposium for Testing and Failure Analysis. 2000. p. 303-306.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
TY - GEN
T1 - Application of Scanning Acoustic Microscopy to Electric and Electronic Parts
AU - Miyasaka, C.
AU - Tittmann, B. R.
PY - 2000
Y1 - 2000
N2 - Ever since the invention of the scanning acoustic microscope (SAM), a key objective has been the enhancement of the resolution in an interior image. Thus, an acoustic lens that can form an interior image with a shear wave has been designed. The use of this lens gives benefits such as an increase of lateral resolution in the interior image, a reduction in background noise caused by surface roughness, and a reduction of spherical aberration. Significantly, with the current trend towards microminiaturization of microelectronic packages, acoustic microscopy with higher resolution and removal of surface roughness can play an important role in diagnostic examinations and failure analysis. In this paper, applications for the lens in microelectronic IC packages will be summarized.
AB - Ever since the invention of the scanning acoustic microscope (SAM), a key objective has been the enhancement of the resolution in an interior image. Thus, an acoustic lens that can form an interior image with a shear wave has been designed. The use of this lens gives benefits such as an increase of lateral resolution in the interior image, a reduction in background noise caused by surface roughness, and a reduction of spherical aberration. Significantly, with the current trend towards microminiaturization of microelectronic packages, acoustic microscopy with higher resolution and removal of surface roughness can play an important role in diagnostic examinations and failure analysis. In this paper, applications for the lens in microelectronic IC packages will be summarized.
UR - http://www.scopus.com/inward/record.url?scp=1542360614&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=1542360614&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:1542360614
SP - 303
EP - 306
BT - Conference Proceedings from the International Symposium for Testing and Failure Analysis
ER -