Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging

Ronald J. Warzoha, Adam A. Wilson, Brian F. Donovan, Nazli Donmezer, Ashutosh Giri, Patrick E. Hopkins, Sukwon Choi, Darshan Pahinkar, Jingjing Shi, Samuel Graham, Zhiting Tian, Laura Ruppalt

Research output: Contribution to journalArticlepeer-review

Abstract

This review introduces relevant nanoscale thermal transport processes that impact thermal abatement in power electronics applications. Specifically, we highlight the importance of nanoscale thermal transport mechanisms at each layer in material hierarchies that make up modern electronic devices. This includes those mechanisms that impact thermal transport through: (1) substrates, (2) interfaces and two-dimensional materials, and (3) heat spreading materials. For each material layer, we provide examples of recent works that (1) demonstrate improvements in thermal performance and/or (2) improve our understanding of the relevance of nanoscale thermal transport across material junctions. We end our discussion by highlighting several additional applications that have benefited from a consideration of nanoscale thermal transport phenomena, including radio frequency (RF) electronics and neuromorphic computing.

Original languageEnglish (US)
Article number020804
JournalJournal of Electronic Packaging, Transactions of the ASME
Volume143
Issue number2
DOIs
StatePublished - Jun 1 2021

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Computer Science Applications
  • Electrical and Electronic Engineering

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