TY - JOUR
T1 - Applications of lasers in microelectronics and micromechanics
AU - Kunz, R. R.
AU - Horn, M. W.
AU - Bloomstein, T. M.
AU - Ehrlich, D. J.
N1 - Funding Information:
This work was sponsored by the Advanced Research Projects Agency and the Department of the Air Force, in part under a specific program supported by the Air Force Office of Scientific Research. We acknowledge C.A. Bukowski, S.G. Cann, D.K. Downs, L.M. Eriksen, C.A. Marchi, B.E. Maxwell and R.W. Otten for their expert technical assistance; W.F. DiNatale for performing electron microscopy; C.L. Dennis, A.R. Forte and K.E. Krohn for mask fabrication; S. Stanton for assistance with the 193 nm Micrascan prototype; F. Goodall for providing the 0.3 NA catadioptric projection optics; and S.T. Palmacci and R.H. Mathews for conducting the laser direct writing development described. We thank T.M. Bloomstein for his important part in the three-dimensional micromachining project.
Copyright:
Copyright 2015 Elsevier B.V., All rights reserved.
PY - 1994/5/2
Y1 - 1994/5/2
N2 - In the near future the laser source will be used to full effect in microfabrication. The spectral brightness of the excimer laser will probably propel it to a position as the dominant source for lithography. This will be implemented at the ArF 193 nm wavelength, perhaps to dimensions as small as 0.15 μm in a production environment. In addition, a second technology, laser direct writing, will take on important strategic applications for circuit prototyping and postfabrication (final step) processing. The former technology is posed as a simpler, faster, and less expensive alternative to X-ray, electron-beam, or ion beam lithography for fabricating next generation VLSI. The latter would make methods available for real-time interactive circuit design and will become an enabling technology for multichip modules and three-dimensional micromechanics.
AB - In the near future the laser source will be used to full effect in microfabrication. The spectral brightness of the excimer laser will probably propel it to a position as the dominant source for lithography. This will be implemented at the ArF 193 nm wavelength, perhaps to dimensions as small as 0.15 μm in a production environment. In addition, a second technology, laser direct writing, will take on important strategic applications for circuit prototyping and postfabrication (final step) processing. The former technology is posed as a simpler, faster, and less expensive alternative to X-ray, electron-beam, or ion beam lithography for fabricating next generation VLSI. The latter would make methods available for real-time interactive circuit design and will become an enabling technology for multichip modules and three-dimensional micromechanics.
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U2 - 10.1016/0169-4332(94)90382-4
DO - 10.1016/0169-4332(94)90382-4
M3 - Article
AN - SCOPUS:0028760946
VL - 79-80
SP - 12
EP - 24
JO - Applied Surface Science
JF - Applied Surface Science
SN - 0169-4332
IS - C
ER -