Abstract
Specific function or application in electronics often requires assembly of heterogeneous materials in a single system. Schemes to achieve such goals are of critical importance for applications ranging from the study in basic cell biology to multifunctional electronics for diagnostics/therapeutics. In this review article, we will first briefly introduce a few assembly techniques, such as microrobotic assembly, guided self-assembly, additive manufacturing, and transfer printing. Among various heterogeneous assembly techniques, transfer printing represents a simple yet versatile tool to integrate vastly different materials or structures in a single system. By utilizing such technique, traditionally challenging tasks have been enabled and they include novel experimental platforms for study of two-dimensional (2D) materials and cells, bio-integrated electronics such as stretchable and biodegradable devices, and three-dimensional (3D) assembly with advanced materials such as semiconductors.
| Original language | English (US) |
|---|---|
| Article number | 020801 |
| Journal | Journal of Electronic Packaging, Transactions of the ASME |
| Volume | 139 |
| Issue number | 2 |
| DOIs | |
| State | Published - Jun 1 2017 |
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All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Mechanics of Materials
- Computer Science Applications
- Electrical and Electronic Engineering
Cite this
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Assembly of Heterogeneous Materials for Biology and Electronics : From Bio-Inspiration to Bio-Integration. / Gao, Yuyan; Cheng, Huanyu.
In: Journal of Electronic Packaging, Transactions of the ASME, Vol. 139, No. 2, 020801, 01.06.2017.Research output: Contribution to journal › Review article
TY - JOUR
T1 - Assembly of Heterogeneous Materials for Biology and Electronics
T2 - From Bio-Inspiration to Bio-Integration
AU - Gao, Yuyan
AU - Cheng, Huanyu
PY - 2017/6/1
Y1 - 2017/6/1
N2 - Specific function or application in electronics often requires assembly of heterogeneous materials in a single system. Schemes to achieve such goals are of critical importance for applications ranging from the study in basic cell biology to multifunctional electronics for diagnostics/therapeutics. In this review article, we will first briefly introduce a few assembly techniques, such as microrobotic assembly, guided self-assembly, additive manufacturing, and transfer printing. Among various heterogeneous assembly techniques, transfer printing represents a simple yet versatile tool to integrate vastly different materials or structures in a single system. By utilizing such technique, traditionally challenging tasks have been enabled and they include novel experimental platforms for study of two-dimensional (2D) materials and cells, bio-integrated electronics such as stretchable and biodegradable devices, and three-dimensional (3D) assembly with advanced materials such as semiconductors.
AB - Specific function or application in electronics often requires assembly of heterogeneous materials in a single system. Schemes to achieve such goals are of critical importance for applications ranging from the study in basic cell biology to multifunctional electronics for diagnostics/therapeutics. In this review article, we will first briefly introduce a few assembly techniques, such as microrobotic assembly, guided self-assembly, additive manufacturing, and transfer printing. Among various heterogeneous assembly techniques, transfer printing represents a simple yet versatile tool to integrate vastly different materials or structures in a single system. By utilizing such technique, traditionally challenging tasks have been enabled and they include novel experimental platforms for study of two-dimensional (2D) materials and cells, bio-integrated electronics such as stretchable and biodegradable devices, and three-dimensional (3D) assembly with advanced materials such as semiconductors.
UR - http://www.scopus.com/inward/record.url?scp=85021729755&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85021729755&partnerID=8YFLogxK
U2 - 10.1115/1.4036238
DO - 10.1115/1.4036238
M3 - Review article
AN - SCOPUS:85021729755
VL - 139
JO - Journal of Electronic Packaging, Transactions of the ASME
JF - Journal of Electronic Packaging, Transactions of the ASME
SN - 1043-7398
IS - 2
M1 - 020801
ER -