Assessing and improving bonding in wet conditions

K. T. Tan, C. C. White, D. L. Hunston, B. D. Vogt, A. P. Haag

Research output: Chapter in Book/Report/Conference proceedingChapter

2 Scopus citations

Abstract

Moisture is a key culprit in degrading adhesive bonds. This chapter reviews recent developments in test methods and techniques that have been used to assess and understand the role moisture plays in bond degradation, placing emphasis on accelerated destructive aging and testing, as well as non-destructive evaluation. Current understanding of interfacial water accumulation and advances in techniques for quantifying interfacial water distribution and diffusion are discussed. Finally, progress in surface pretreatment techniques, modification of bulk properties, engineering of novel biological adhesives and joint design considerations for improving adhesive bonds in wet conditions are presented.

Original languageEnglish (US)
Title of host publicationAdvances in Structural Adhesive Bonding
PublisherElsevier Inc.
Pages547-573
Number of pages27
ISBN (Print)9781845694357
DOIs
Publication statusPublished - Mar 2010

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All Science Journal Classification (ASJC) codes

  • Engineering(all)

Cite this

Tan, K. T., White, C. C., Hunston, D. L., Vogt, B. D., & Haag, A. P. (2010). Assessing and improving bonding in wet conditions. In Advances in Structural Adhesive Bonding (pp. 547-573). Elsevier Inc.. https://doi.org/10.1533/9781845698058.4.547