Automatic visual inspection of surface mount solder joint defects

O. Oyeleye, E. A. Lehtihet

Research output: Contribution to journalArticle

10 Scopus citations

Abstract

The ever increasing use of surface mount technology in printed circuit board assembly has considerably increased the importance of automated solder joint inspection. This paper documents our experience with the development of an experimental automated solder joint inspection system. Dominant solder joint defect classes are identified. Three-dimensional geometric models of these defects are created and used to test a non-parametric classification algorithm and optimal feature selection scheme. The classification algorithm and optimal feature selection scheme are then implemented on an experimental system using a laser line and vision system for solder joint data acquisition. The capability and limitations of this system are assessed through experimentation with actual solder joint defects.

Original languageEnglish (US)
Pages (from-to)1217-1242
Number of pages26
JournalInternational Journal of Production Research
Volume37
Issue number6
DOIs
StatePublished - Apr 1999

All Science Journal Classification (ASJC) codes

  • Strategy and Management
  • Management Science and Operations Research
  • Industrial and Manufacturing Engineering

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