Cerium oxide slurries in CMP. Electrophoretic mobility and adsorption investigations of ceria/silicate interaction

Preuchsuda Suphantharida, Kwadwo Asare Osseo-Asare

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Abstract

The interaction between ceria particles and silicate ions was studied in order to further understand the mechanism of chemical-mechanical polishing (CMP) of silicon-based materials. Electrophoretic mobility (zeta potential) and adsorption measurements were the techniques utilized. In the presence of silicate ions, the zeta potential of ceria particles changed from positive to negative; in addition, the isoelectric point IEP of the particles shifted to lower pH values with increasing silicate addition. The adsorption density of silicate ions on ceria was found to increase as the concentration of silicate ions in the system increased. Also, with increase in pH, silicate adsorption went through a maximum at about pH 9, then decreased rapidly at higher pH values. The adsorption and zeta potential results are rationalized by considering the solution chemistry of the dissolved silicate species, the protonation/deprotonation of ceria surface, and the accompanying surface complexation reactions. These experimental observations demonstrate a strong interaction between ceria particles and silicate ions. The implication is that adsorption of silicate ions on ceria may be directly involved in the removal mechanism of silicon-based materials during the CMP process.

Original languageEnglish (US)
JournalJournal of the Electrochemical Society
Volume151
Issue number10
DOIs
StatePublished - Nov 26 2004

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Silicates
cerium oxides
Electrophoretic mobility
slurries
Chemical mechanical polishing
Cerium compounds
Slurries
Cerium
polishing
silicates
Adsorption
adsorption
Oxides
Ions
interactions
Zeta potential
ions
Silicon
ceric oxide
Deprotonation

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Renewable Energy, Sustainability and the Environment
  • Surfaces, Coatings and Films
  • Electrochemistry
  • Materials Chemistry

Cite this

@article{72089c3e196d42c69abdc99e9770d1f5,
title = "Cerium oxide slurries in CMP. Electrophoretic mobility and adsorption investigations of ceria/silicate interaction",
abstract = "The interaction between ceria particles and silicate ions was studied in order to further understand the mechanism of chemical-mechanical polishing (CMP) of silicon-based materials. Electrophoretic mobility (zeta potential) and adsorption measurements were the techniques utilized. In the presence of silicate ions, the zeta potential of ceria particles changed from positive to negative; in addition, the isoelectric point IEP of the particles shifted to lower pH values with increasing silicate addition. The adsorption density of silicate ions on ceria was found to increase as the concentration of silicate ions in the system increased. Also, with increase in pH, silicate adsorption went through a maximum at about pH 9, then decreased rapidly at higher pH values. The adsorption and zeta potential results are rationalized by considering the solution chemistry of the dissolved silicate species, the protonation/deprotonation of ceria surface, and the accompanying surface complexation reactions. These experimental observations demonstrate a strong interaction between ceria particles and silicate ions. The implication is that adsorption of silicate ions on ceria may be directly involved in the removal mechanism of silicon-based materials during the CMP process.",
author = "Preuchsuda Suphantharida and Osseo-Asare, {Kwadwo Asare}",
year = "2004",
month = "11",
day = "26",
doi = "10.1149/1.1785793",
language = "English (US)",
volume = "151",
journal = "Journal of the Electrochemical Society",
issn = "0013-4651",
publisher = "Electrochemical Society, Inc.",
number = "10",

}

TY - JOUR

T1 - Cerium oxide slurries in CMP. Electrophoretic mobility and adsorption investigations of ceria/silicate interaction

AU - Suphantharida, Preuchsuda

AU - Osseo-Asare, Kwadwo Asare

PY - 2004/11/26

Y1 - 2004/11/26

N2 - The interaction between ceria particles and silicate ions was studied in order to further understand the mechanism of chemical-mechanical polishing (CMP) of silicon-based materials. Electrophoretic mobility (zeta potential) and adsorption measurements were the techniques utilized. In the presence of silicate ions, the zeta potential of ceria particles changed from positive to negative; in addition, the isoelectric point IEP of the particles shifted to lower pH values with increasing silicate addition. The adsorption density of silicate ions on ceria was found to increase as the concentration of silicate ions in the system increased. Also, with increase in pH, silicate adsorption went through a maximum at about pH 9, then decreased rapidly at higher pH values. The adsorption and zeta potential results are rationalized by considering the solution chemistry of the dissolved silicate species, the protonation/deprotonation of ceria surface, and the accompanying surface complexation reactions. These experimental observations demonstrate a strong interaction between ceria particles and silicate ions. The implication is that adsorption of silicate ions on ceria may be directly involved in the removal mechanism of silicon-based materials during the CMP process.

AB - The interaction between ceria particles and silicate ions was studied in order to further understand the mechanism of chemical-mechanical polishing (CMP) of silicon-based materials. Electrophoretic mobility (zeta potential) and adsorption measurements were the techniques utilized. In the presence of silicate ions, the zeta potential of ceria particles changed from positive to negative; in addition, the isoelectric point IEP of the particles shifted to lower pH values with increasing silicate addition. The adsorption density of silicate ions on ceria was found to increase as the concentration of silicate ions in the system increased. Also, with increase in pH, silicate adsorption went through a maximum at about pH 9, then decreased rapidly at higher pH values. The adsorption and zeta potential results are rationalized by considering the solution chemistry of the dissolved silicate species, the protonation/deprotonation of ceria surface, and the accompanying surface complexation reactions. These experimental observations demonstrate a strong interaction between ceria particles and silicate ions. The implication is that adsorption of silicate ions on ceria may be directly involved in the removal mechanism of silicon-based materials during the CMP process.

UR - http://www.scopus.com/inward/record.url?scp=8644292623&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=8644292623&partnerID=8YFLogxK

U2 - 10.1149/1.1785793

DO - 10.1149/1.1785793

M3 - Article

VL - 151

JO - Journal of the Electrochemical Society

JF - Journal of the Electrochemical Society

SN - 0013-4651

IS - 10

ER -