Silver contacts to single-crystal Bi2Sr2CaCu2Ox (Bi-2212) and polycrystalltine (Bi,Pb)2Sr2Ca2Cu3Ox (B-2223) were prepared by sputtering or sinter-forging techniques. The interfacial resistivity of Ag/Bi-2212, defined as interfacial resistance times contact area, decreased from 10-4 to 10-10 Ω cm2 at 77 K when the thermal annealing time increased from 1 to 14 h at 600°C; it was also a function of the annealing temperature. The lowest interfacial resistivity of Ag/Bi-2223 that was sinter-forged at 840-845°C for 1 h was 10-9 Ω cm2 at 77 K. Experimental data are compared with intrinsic interfacial resistivity and resistivity values found in the literature.
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Energy Engineering and Power Technology
- Electrical and Electronic Engineering