Characterization of the electrical performance of different signal via geometries

Sedig Salem Agili, Stephen B. Smith, Vittal Balasubramanian

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

Several signal via geometries are analyzed for across and through transmission by varying the drill-hole diameter, ratio of the pad and antipad diameters to drill-hole diameter, and number of ground planes. Time- and frequency-domain results showing impedance-, insertion-, and return-loss trends, which are useful for designing via geometries for high-speed transmission, are obtained.

Original languageEnglish (US)
Pages (from-to)315-320
Number of pages6
JournalMicrowave and Optical Technology Letters
Volume48
Issue number2
DOIs
StatePublished - Feb 1 2006

Fingerprint

Geometry
geometry
insertion
high speed
impedance
trends

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

Cite this

Agili, Sedig Salem ; Smith, Stephen B. ; Balasubramanian, Vittal. / Characterization of the electrical performance of different signal via geometries. In: Microwave and Optical Technology Letters. 2006 ; Vol. 48, No. 2. pp. 315-320.
@article{d74e1467a6724ab5af2c491398db896d,
title = "Characterization of the electrical performance of different signal via geometries",
abstract = "Several signal via geometries are analyzed for across and through transmission by varying the drill-hole diameter, ratio of the pad and antipad diameters to drill-hole diameter, and number of ground planes. Time- and frequency-domain results showing impedance-, insertion-, and return-loss trends, which are useful for designing via geometries for high-speed transmission, are obtained.",
author = "Agili, {Sedig Salem} and Smith, {Stephen B.} and Vittal Balasubramanian",
year = "2006",
month = "2",
day = "1",
doi = "10.1002/mop.21336",
language = "English (US)",
volume = "48",
pages = "315--320",
journal = "Microwave and Optical Technology Letters",
issn = "0895-2477",
publisher = "John Wiley and Sons Inc.",
number = "2",

}

Characterization of the electrical performance of different signal via geometries. / Agili, Sedig Salem; Smith, Stephen B.; Balasubramanian, Vittal.

In: Microwave and Optical Technology Letters, Vol. 48, No. 2, 01.02.2006, p. 315-320.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Characterization of the electrical performance of different signal via geometries

AU - Agili, Sedig Salem

AU - Smith, Stephen B.

AU - Balasubramanian, Vittal

PY - 2006/2/1

Y1 - 2006/2/1

N2 - Several signal via geometries are analyzed for across and through transmission by varying the drill-hole diameter, ratio of the pad and antipad diameters to drill-hole diameter, and number of ground planes. Time- and frequency-domain results showing impedance-, insertion-, and return-loss trends, which are useful for designing via geometries for high-speed transmission, are obtained.

AB - Several signal via geometries are analyzed for across and through transmission by varying the drill-hole diameter, ratio of the pad and antipad diameters to drill-hole diameter, and number of ground planes. Time- and frequency-domain results showing impedance-, insertion-, and return-loss trends, which are useful for designing via geometries for high-speed transmission, are obtained.

UR - http://www.scopus.com/inward/record.url?scp=33645669324&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=33645669324&partnerID=8YFLogxK

U2 - 10.1002/mop.21336

DO - 10.1002/mop.21336

M3 - Article

AN - SCOPUS:33645669324

VL - 48

SP - 315

EP - 320

JO - Microwave and Optical Technology Letters

JF - Microwave and Optical Technology Letters

SN - 0895-2477

IS - 2

ER -