Chemical Mechanical Polishing of Tungsten: Effect of Tungstate Ion on the Electrochemical Behavior of Tungsten

K. Osseo-Asare, M. Anik, J. DeSimone

Research output: Contribution to journalArticle

10 Scopus citations

Abstract

The effect of tungstate ion on the electrochemical behavior of tungsten has been investigated using direct current potentiodynamic polarization. As the concentration of tungstate ion increases, the anodic current increases and shifts to less noble potentials. This unexpected result is attributed to the solubilization (via polymerization) of tungstate ions generated via W dissolution, by the tungstate species previously introduced into solution. With the iodate ion as a model oxidizer, the dissolution current was found to increase in the presence of added tungstate ions. This suggests that tungstate ions can facilitate the metal dissolution during tungsten chemical mechanical polishing.

Original languageEnglish (US)
Pages (from-to)143-144
Number of pages2
JournalElectrochemical and Solid-State Letters
Volume2
Issue number3
DOIs
StatePublished - Mar 1999

All Science Journal Classification (ASJC) codes

  • Chemical Engineering(all)
  • Materials Science(all)
  • Physical and Theoretical Chemistry
  • Electrochemistry
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'Chemical Mechanical Polishing of Tungsten: Effect of Tungstate Ion on the Electrochemical Behavior of Tungsten'. Together they form a unique fingerprint.

  • Cite this