Cold sintering process

A new era for ceramic packaging and microwave device development

Jing Guo, Amanda L. Baker, Hanzheng Guo, Michael T. Lanagan, Clive A. Randall

Research output: Contribution to journalArticle

41 Citations (Scopus)

Abstract

Cold sintering process (CSP) is an extremely low-temperature sintering process (room temperature to ~200°C) that uses aqueous-based solutions as transient solvents to aid densification by a nonequilibrium dissolution-precipitation process. In this work, CSP is introduced to fabricate microwave and packaging dielectric substrates, including ceramics (bulk monolithic substrates and multilayers) and ceramic-polymer composites. Some dielectric materials, namely Li2MoO4, Na2Mo2O7, K2Mo2O7, and (LiBi)0.5MoO4 ceramics, and also (1−x)Li2MoO4−xPTFE and (1−x)(LiBi)0.5MoO4−xPTFE composites, are selected to demonstrate the feasibility of CSP in microwave and packaging substrate applications. Selected dielectric ceramics and composites with high densities (88%-95%) and good microwave dielectric properties (permittivity, 5.6-37.1; Q × f, 1700-30 500 GHz) were obtained by CSP at 120°C. CSP can be also used to potentially develop a new co-fired ceramic technology, namely CSCC. Li2MoO4−Ag multilayer co-fired ceramic structures were successfully fabricated without obvious delamination, warping, or interdiffusion. Numerous materials with different dielectric properties can be densified by CSP, indicating that CSP provides a simple, effective, and energy-saving strategy for the ceramic packaging and microwave device development.

Original languageEnglish (US)
Pages (from-to)669-677
Number of pages9
JournalJournal of the American Ceramic Society
Volume100
Issue number2
DOIs
StatePublished - Feb 1 2017

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Microwave devices
Packaging
Sintering
Microwaves
Dielectric properties
Composite materials
Multilayers
Substrates
Interdiffusion (solids)
Densification
Delamination
Energy conservation
Polymers
Dissolution
Permittivity
Temperature

All Science Journal Classification (ASJC) codes

  • Ceramics and Composites
  • Materials Chemistry

Cite this

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title = "Cold sintering process: A new era for ceramic packaging and microwave device development",
abstract = "Cold sintering process (CSP) is an extremely low-temperature sintering process (room temperature to ~200°C) that uses aqueous-based solutions as transient solvents to aid densification by a nonequilibrium dissolution-precipitation process. In this work, CSP is introduced to fabricate microwave and packaging dielectric substrates, including ceramics (bulk monolithic substrates and multilayers) and ceramic-polymer composites. Some dielectric materials, namely Li2MoO4, Na2Mo2O7, K2Mo2O7, and (LiBi)0.5MoO4 ceramics, and also (1−x)Li2MoO4−xPTFE and (1−x)(LiBi)0.5MoO4−xPTFE composites, are selected to demonstrate the feasibility of CSP in microwave and packaging substrate applications. Selected dielectric ceramics and composites with high densities (88{\%}-95{\%}) and good microwave dielectric properties (permittivity, 5.6-37.1; Q × f, 1700-30 500 GHz) were obtained by CSP at 120°C. CSP can be also used to potentially develop a new co-fired ceramic technology, namely CSCC. Li2MoO4−Ag multilayer co-fired ceramic structures were successfully fabricated without obvious delamination, warping, or interdiffusion. Numerous materials with different dielectric properties can be densified by CSP, indicating that CSP provides a simple, effective, and energy-saving strategy for the ceramic packaging and microwave device development.",
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Cold sintering process : A new era for ceramic packaging and microwave device development. / Guo, Jing; Baker, Amanda L.; Guo, Hanzheng; Lanagan, Michael T.; Randall, Clive A.

In: Journal of the American Ceramic Society, Vol. 100, No. 2, 01.02.2017, p. 669-677.

Research output: Contribution to journalArticle

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AU - Guo, Hanzheng

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