Comparison of S-parameter concatenation to full-wave simulation for high-speed interconnect analysis

Vittal Balasubramanian, Stephen B. Smith, Sedig Salem Agili

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

A standard method of high-speed digital channel simulation involves dividing the channel into discrete parts and analyzing each part independently to determine its individual S-parameters. These S-parameters are then combined or concatenated to determine the overall channel performance. Analyzed here is a portion of such a channel composed of a high-speed connector and it's footprint on a printed circuit board. For this structure, the paper compares the concatenation method to a single full-wave simulation of the entire structure. The first method is evaluated to determine its upper frequency limit thus showing when it is appropriate to use it over full-wave analysis, which is typically more complex and time consuming. Additionally, some structures that are not accounted for when using the concatenation method are investigated.

Original languageEnglish (US)
Title of host publicationInternational Engineering Consortium - DesignCon 2007
Pages1629-1643
Number of pages15
StatePublished - Dec 1 2007
EventDesignCon 2007 - Santa Clara, CA, United States
Duration: Jan 29 2007Feb 1 2007

Publication series

NameInternational Engineering Consortium - DesignCon 2007
Volume3

Other

OtherDesignCon 2007
CountryUnited States
CitySanta Clara, CA
Period1/29/072/1/07

Fingerprint

Scattering parameters
Printed circuit boards

All Science Journal Classification (ASJC) codes

  • Computer Networks and Communications
  • Electrical and Electronic Engineering

Cite this

Balasubramanian, V., Smith, S. B., & Agili, S. S. (2007). Comparison of S-parameter concatenation to full-wave simulation for high-speed interconnect analysis. In International Engineering Consortium - DesignCon 2007 (pp. 1629-1643). (International Engineering Consortium - DesignCon 2007; Vol. 3).
Balasubramanian, Vittal ; Smith, Stephen B. ; Agili, Sedig Salem. / Comparison of S-parameter concatenation to full-wave simulation for high-speed interconnect analysis. International Engineering Consortium - DesignCon 2007. 2007. pp. 1629-1643 (International Engineering Consortium - DesignCon 2007).
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Balasubramanian, V, Smith, SB & Agili, SS 2007, Comparison of S-parameter concatenation to full-wave simulation for high-speed interconnect analysis. in International Engineering Consortium - DesignCon 2007. International Engineering Consortium - DesignCon 2007, vol. 3, pp. 1629-1643, DesignCon 2007, Santa Clara, CA, United States, 1/29/07.

Comparison of S-parameter concatenation to full-wave simulation for high-speed interconnect analysis. / Balasubramanian, Vittal; Smith, Stephen B.; Agili, Sedig Salem.

International Engineering Consortium - DesignCon 2007. 2007. p. 1629-1643 (International Engineering Consortium - DesignCon 2007; Vol. 3).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Balasubramanian V, Smith SB, Agili SS. Comparison of S-parameter concatenation to full-wave simulation for high-speed interconnect analysis. In International Engineering Consortium - DesignCon 2007. 2007. p. 1629-1643. (International Engineering Consortium - DesignCon 2007).