Controlled manipulation of wetting characteristics of nanoparticles with dry-based plasma polymerization method

Anaram Shahravan, Tapan Desai, Themis Matsoukas

Research output: Contribution to journalArticle

7 Citations (Scopus)

Abstract

A dry process for tailoring nanoparticle wetting characteristics using plasma enhanced chemical vapor deposition technique is established. The "plasma polymer" coating imparts the properties of the precursors used in the plasma technique, without the requirement for nanoparticle surface preparation. For a range of chosen precursors, the water contact angle of a sessile droplet on coated copper oxide nanoparticles was shown to vary from 54 ° to 76 °, 92 ° to 108 °. Stable suspensions of coated nanoparticles were demonstrated.

Original languageEnglish (US)
Article number251603
JournalApplied Physics Letters
Volume101
Issue number25
DOIs
StatePublished - Dec 17 2012

Fingerprint

wetting
manipulators
polymerization
nanoparticles
copper oxides
vapor deposition
coatings
requirements
preparation
polymers
water

All Science Journal Classification (ASJC) codes

  • Physics and Astronomy (miscellaneous)

Cite this

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Controlled manipulation of wetting characteristics of nanoparticles with dry-based plasma polymerization method. / Shahravan, Anaram; Desai, Tapan; Matsoukas, Themis.

In: Applied Physics Letters, Vol. 101, No. 25, 251603, 17.12.2012.

Research output: Contribution to journalArticle

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