Crosstalk analysis for varying degree of in-pair coupling in coupled differential pairs

Kapil Sharma, Sedig Salem Agili, Stephen B. Smith

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Differentially-routed traces on printed circuit boards typically incorporate loose in-pair coupling when compared to the coupling between the traces and the ground planes. Loose coupling facilitates in-pair skew correction without affecting the differential-mode impedance. However, practical channels combine printed circuit boards with other components that have different degrees of in-pair coupling which could affect the crosstalk among adjacent pairs. This paper examines the effects of different degrees of in-pair coupling on near end crosstalk in the absence of in-pair skew. The analysis will help printed circuit board designers to choose the desired degree of in-pair coupling to achieve targeted near end crosstalk performance.

Original languageEnglish (US)
Title of host publication2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages95-97
Number of pages3
ISBN (Electronic)9781509061846
DOIs
StatePublished - Apr 5 2017
Event2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016 - Honolulu, United States
Duration: Dec 14 2016Dec 16 2016

Other

Other2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016
CountryUnited States
CityHonolulu
Period12/14/1612/16/16

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Crosstalk
Printed circuit boards
Printed Circuit Board
Skew
Trace
Impedance
Adjacent
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All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Modeling and Simulation

Cite this

Sharma, K., Agili, S. S., & Smith, S. B. (2017). Crosstalk analysis for varying degree of in-pair coupling in coupled differential pairs. In 2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016 (pp. 95-97). [7893135] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EDAPS.2016.7893135
Sharma, Kapil ; Agili, Sedig Salem ; Smith, Stephen B. / Crosstalk analysis for varying degree of in-pair coupling in coupled differential pairs. 2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016. Institute of Electrical and Electronics Engineers Inc., 2017. pp. 95-97
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Sharma, K, Agili, SS & Smith, SB 2017, Crosstalk analysis for varying degree of in-pair coupling in coupled differential pairs. in 2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016., 7893135, Institute of Electrical and Electronics Engineers Inc., pp. 95-97, 2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016, Honolulu, United States, 12/14/16. https://doi.org/10.1109/EDAPS.2016.7893135

Crosstalk analysis for varying degree of in-pair coupling in coupled differential pairs. / Sharma, Kapil; Agili, Sedig Salem; Smith, Stephen B.

2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016. Institute of Electrical and Electronics Engineers Inc., 2017. p. 95-97 7893135.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Sharma K, Agili SS, Smith SB. Crosstalk analysis for varying degree of in-pair coupling in coupled differential pairs. In 2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016. Institute of Electrical and Electronics Engineers Inc. 2017. p. 95-97. 7893135 https://doi.org/10.1109/EDAPS.2016.7893135