Cure kinetics and physical aging of an ambient-curing epoxy resin

Anurag Jaipuriar, Charles E. Bakis, Maria M. Lopez

Research output: Contribution to conferencePaper

2 Citations (Scopus)

Abstract

Epoxy resins employed in externally bonded fiber reinforced polymer (FRP) systems used for the repair and strengthening of civil engineering structures are typically cured under ambient temperature conditions. In the present investigation, the cure kinetics of a commercially available ambient-curing epoxy resin was studied using differential scanning calorimetry (DSC). The isoconversion map technique was followed to develop a graphical means of predicting degree of cure for a given temperature history. The isoconversion map was used to conclude that no progress in chemical cure occurred in the resin cured and aged at 22°C beyond the first 7 days of curing. DSC results also established that physical aging took place in the resin and that the rate of physical aging increased with the aging temperature (below the Tg). To study the kinetics of physical aging, specimens were aged at 30°C, 35°C and 22°C beyond the first 7 days of cure at 22°C. The Tg evolution at different aging temperatures was measured using DSC. Based on the Tg measurements, an extent-of-aging parameter was defined to parameterize the extent of physical aging and evolution of the resin towards equilibrium at the aging temperature. This information is useful for understanding the thermomechanical behavior of the epoxy resin.

Original languageEnglish (US)
StatePublished - Jan 1 2012
Event6th International Conference on FRP Composites in Civil Engineering, CICE 2012 - Rome, Italy
Duration: Jun 13 2012Jun 15 2012

Other

Other6th International Conference on FRP Composites in Civil Engineering, CICE 2012
CountryItaly
CityRome
Period6/13/126/15/12

Fingerprint

Epoxy Resins
Epoxy resins
Curing
Aging of materials
Kinetics
Differential scanning calorimetry
Resins
Temperature
Civil engineering
Polymers
Repair
Fibers

All Science Journal Classification (ASJC) codes

  • Polymers and Plastics
  • Civil and Structural Engineering

Cite this

Jaipuriar, A., Bakis, C. E., & Lopez, M. M. (2012). Cure kinetics and physical aging of an ambient-curing epoxy resin. Paper presented at 6th International Conference on FRP Composites in Civil Engineering, CICE 2012, Rome, Italy.
Jaipuriar, Anurag ; Bakis, Charles E. ; Lopez, Maria M. / Cure kinetics and physical aging of an ambient-curing epoxy resin. Paper presented at 6th International Conference on FRP Composites in Civil Engineering, CICE 2012, Rome, Italy.
@conference{629d692c7c8f4d8c9c64fa7d6c1c2f17,
title = "Cure kinetics and physical aging of an ambient-curing epoxy resin",
abstract = "Epoxy resins employed in externally bonded fiber reinforced polymer (FRP) systems used for the repair and strengthening of civil engineering structures are typically cured under ambient temperature conditions. In the present investigation, the cure kinetics of a commercially available ambient-curing epoxy resin was studied using differential scanning calorimetry (DSC). The isoconversion map technique was followed to develop a graphical means of predicting degree of cure for a given temperature history. The isoconversion map was used to conclude that no progress in chemical cure occurred in the resin cured and aged at 22°C beyond the first 7 days of curing. DSC results also established that physical aging took place in the resin and that the rate of physical aging increased with the aging temperature (below the Tg). To study the kinetics of physical aging, specimens were aged at 30°C, 35°C and 22°C beyond the first 7 days of cure at 22°C. The Tg evolution at different aging temperatures was measured using DSC. Based on the Tg measurements, an extent-of-aging parameter was defined to parameterize the extent of physical aging and evolution of the resin towards equilibrium at the aging temperature. This information is useful for understanding the thermomechanical behavior of the epoxy resin.",
author = "Anurag Jaipuriar and Bakis, {Charles E.} and Lopez, {Maria M.}",
year = "2012",
month = "1",
day = "1",
language = "English (US)",
note = "6th International Conference on FRP Composites in Civil Engineering, CICE 2012 ; Conference date: 13-06-2012 Through 15-06-2012",

}

Jaipuriar, A, Bakis, CE & Lopez, MM 2012, 'Cure kinetics and physical aging of an ambient-curing epoxy resin', Paper presented at 6th International Conference on FRP Composites in Civil Engineering, CICE 2012, Rome, Italy, 6/13/12 - 6/15/12.

Cure kinetics and physical aging of an ambient-curing epoxy resin. / Jaipuriar, Anurag; Bakis, Charles E.; Lopez, Maria M.

2012. Paper presented at 6th International Conference on FRP Composites in Civil Engineering, CICE 2012, Rome, Italy.

Research output: Contribution to conferencePaper

TY - CONF

T1 - Cure kinetics and physical aging of an ambient-curing epoxy resin

AU - Jaipuriar, Anurag

AU - Bakis, Charles E.

AU - Lopez, Maria M.

PY - 2012/1/1

Y1 - 2012/1/1

N2 - Epoxy resins employed in externally bonded fiber reinforced polymer (FRP) systems used for the repair and strengthening of civil engineering structures are typically cured under ambient temperature conditions. In the present investigation, the cure kinetics of a commercially available ambient-curing epoxy resin was studied using differential scanning calorimetry (DSC). The isoconversion map technique was followed to develop a graphical means of predicting degree of cure for a given temperature history. The isoconversion map was used to conclude that no progress in chemical cure occurred in the resin cured and aged at 22°C beyond the first 7 days of curing. DSC results also established that physical aging took place in the resin and that the rate of physical aging increased with the aging temperature (below the Tg). To study the kinetics of physical aging, specimens were aged at 30°C, 35°C and 22°C beyond the first 7 days of cure at 22°C. The Tg evolution at different aging temperatures was measured using DSC. Based on the Tg measurements, an extent-of-aging parameter was defined to parameterize the extent of physical aging and evolution of the resin towards equilibrium at the aging temperature. This information is useful for understanding the thermomechanical behavior of the epoxy resin.

AB - Epoxy resins employed in externally bonded fiber reinforced polymer (FRP) systems used for the repair and strengthening of civil engineering structures are typically cured under ambient temperature conditions. In the present investigation, the cure kinetics of a commercially available ambient-curing epoxy resin was studied using differential scanning calorimetry (DSC). The isoconversion map technique was followed to develop a graphical means of predicting degree of cure for a given temperature history. The isoconversion map was used to conclude that no progress in chemical cure occurred in the resin cured and aged at 22°C beyond the first 7 days of curing. DSC results also established that physical aging took place in the resin and that the rate of physical aging increased with the aging temperature (below the Tg). To study the kinetics of physical aging, specimens were aged at 30°C, 35°C and 22°C beyond the first 7 days of cure at 22°C. The Tg evolution at different aging temperatures was measured using DSC. Based on the Tg measurements, an extent-of-aging parameter was defined to parameterize the extent of physical aging and evolution of the resin towards equilibrium at the aging temperature. This information is useful for understanding the thermomechanical behavior of the epoxy resin.

UR - http://www.scopus.com/inward/record.url?scp=84924358526&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84924358526&partnerID=8YFLogxK

M3 - Paper

AN - SCOPUS:84924358526

ER -

Jaipuriar A, Bakis CE, Lopez MM. Cure kinetics and physical aging of an ambient-curing epoxy resin. 2012. Paper presented at 6th International Conference on FRP Composites in Civil Engineering, CICE 2012, Rome, Italy.