Deformation and recrystallization texture of heavily drawn OFHC copper

Daudi R. Waryoba, Peter N. Kalu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

Deformation and recrystallization texture has been investigated in Oxygen free high conducting (OFHC) copper wires drawn at room temperature to true strain of 2.31, and isothermally annealed at various temperatures between 150°C and 750°C. Local orientations of the microstructures were measured by means of electron backscattered diffraction (EBSD) technique. While the drawn wire was characterized by a major〈111〉 + minor〈100〉 duplex fiber texture, recrystallization occurred at annealing temperatures between 250°C and 400°C and resulted into a major〈100〉 +minor〈111〉 recrystallization texture. At temperatures above 500°C, the 〈100〉 dominated recrystallization texture changed to the 〈111〉 dominated growth texture due to secondary recrystallization, which favored the 〈111〉 orientation at the expense of the 〈100〉 component.

Original languageEnglish (US)
Title of host publicationTextures of Materials, ICOTOM 14 - Proceedings of the 14th International Conference on Textures of Materials
Pages877-882
Number of pages6
Volume495-497
EditionPART 2
StatePublished - 2005
Event14th International Conference on Textures of Materials, ICOTOM 14 - Leuven, Belgium
Duration: Jul 11 2005Jul 15 2005

Publication series

NameMaterials Science Forum
NumberPART 2
Volume495-497
ISSN (Print)02555476

Other

Other14th International Conference on Textures of Materials, ICOTOM 14
CountryBelgium
CityLeuven
Period7/11/057/15/05

All Science Journal Classification (ASJC) codes

  • Materials Science(all)

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