Abstract
A CH4 atmospheric rf plasma treatment process was demonstrated for hydrophobic treatments of various substrates including metallic and insulating surfaces as well as flat and rough surfaces. A stable rf glow plasma was generated over a 1 cm × 16 cm area using a cylindrical electrode geometry. A typical hydrophobic treatment speed was 5-10 cm min-1. CH4 plasma polymerization deposited a very smooth hydrocarbon layer composed of CH2 and CH3 groups. The inclusion of oxygenated species was less than 1%. On flat substrates, the water contact angle was ∼90°. On rough surfaces such as cotton, the contact angle reached up to 150°. Since this method does not require vacuum or any special venting systems, it will be suitable for in-line processing of a wide range of substrate materials.
Original language | English (US) |
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Pages (from-to) | 977-981 |
Number of pages | 5 |
Journal | Journal of Materials Chemistry |
Volume | 16 |
Issue number | 10 |
DOIs | |
State | Published - Mar 8 2006 |
All Science Journal Classification (ASJC) codes
- Chemistry(all)
- Materials Chemistry