Design and development of component-based equipment connectivity for semiconductor manufacturing

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

In the Semiconductor Industry, the communication between a host application and equipment is performed using some standardized communication protocols, such as SECS I, SECS II, or GEM. However, specific equipment requirements and proprietary messages frequently make the equipment connectivity non-interoperable. By taking advantage of component software computing technology, a generic equipment integration interface called Component-based Equipment Connectivity (CEC) is proposed. CEC is designed as an assemblage of various customizable components, such as communication, message/control, and data repository. When these components are instantiated with equipment-dependent parameters, an operational CEC can be created for a specific type of GEM-compliant semiconductor equipment. Using XML as the data representation vehicle, communicated messages become language/platform independent and ease of integration is promoted.

Original languageEnglish (US)
Title of host publicationFourth International Conference on Control and Automation
Pages63-67
Number of pages5
StatePublished - Dec 1 2003
EventFourth International Conference on Control and Automation - Montreal, Que., Canada
Duration: Jun 10 2003Jun 12 2003

Publication series

NameInternational Conference on Control and Automation

Other

OtherFourth International Conference on Control and Automation
CountryCanada
CityMontreal, Que.
Period6/10/036/12/03

Fingerprint

Semiconductor materials
Air cushion vehicles
Communication
XML
Network protocols
Industry

All Science Journal Classification (ASJC) codes

  • Control and Systems Engineering

Cite this

Qiu, G., & Laplante, P. A. (2003). Design and development of component-based equipment connectivity for semiconductor manufacturing. In Fourth International Conference on Control and Automation (pp. 63-67). [TuA03-1] (International Conference on Control and Automation).
Qiu, Guanghua ; Laplante, Phillip A. / Design and development of component-based equipment connectivity for semiconductor manufacturing. Fourth International Conference on Control and Automation. 2003. pp. 63-67 (International Conference on Control and Automation).
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Qiu, G & Laplante, PA 2003, Design and development of component-based equipment connectivity for semiconductor manufacturing. in Fourth International Conference on Control and Automation., TuA03-1, International Conference on Control and Automation, pp. 63-67, Fourth International Conference on Control and Automation, Montreal, Que., Canada, 6/10/03.

Design and development of component-based equipment connectivity for semiconductor manufacturing. / Qiu, Guanghua; Laplante, Phillip A.

Fourth International Conference on Control and Automation. 2003. p. 63-67 TuA03-1 (International Conference on Control and Automation).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Qiu G, Laplante PA. Design and development of component-based equipment connectivity for semiconductor manufacturing. In Fourth International Conference on Control and Automation. 2003. p. 63-67. TuA03-1. (International Conference on Control and Automation).