In this paper we present a novel MEMS force sensor that exploits the post-buckling phenomenon of slender silicon columns. The design philosophy and fabrication process is discussed and analytical expressions for the force-displacement characteristics are developed. The sensor can be used to perform quantitative and qualitative measurements in-situ in SEM, TEM or STM, where the small chamber size makes it challenging to integrate conventional force-displacement sensors. Potential applications for the sensor are characterization of carbon nanotube-polymer interfaces, nanoscale thin film testing and mechanical testing of single biological cells.
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Surfaces, Coatings and Films
- Metals and Alloys
- Electrical and Electronic Engineering