Design of compliant force and displacement amplification micro-mechanisms

Matthew B. Parkinson, Brian D. Jensen, Katsuo Kurabayashl

Research output: Contribution to conferencePaper

10 Scopus citations

Abstract

In many MEMS applications, it is desirable to amplify the force or displacement of an actuator or transducer. Devices that amplify force or mechanical advantage typically achieve this at the expense of displacement or geometric advantage. Likewise, devices that amplify geometric advantage do so at the expense of mechanical advantage. This paper proposes a device topology based on a four-link mechanism with compliant segments in place of hinges. Finite-element analysis and optimization were used to develop a Pareto set of solutions quantifying the force / displacement trade-off for a variety of loading conditions. Depending on these conditions, this device is capable of multiplying force inputs by as much as 23.7 and displacement inputs by as much as 588. Efficiency of these designs improves as the two objectives (mechanical and geometric advantage) are considered jointly in a multicriteria optimization problem rather than individually.

Original languageEnglish (US)
Pages741-748
Number of pages8
Publication statusPublished - Dec 1 2001
Event2001 ASME Design Engineering Technical Conference and Computers and Information in Engineering Conference - Pittsburgh, PA, United States
Duration: Sep 9 2001Sep 12 2001

Other

Other2001 ASME Design Engineering Technical Conference and Computers and Information in Engineering Conference
CountryUnited States
CityPittsburgh, PA
Period9/9/019/12/01

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All Science Journal Classification (ASJC) codes

  • Modeling and Simulation
  • Mechanical Engineering
  • Computer Science Applications
  • Computer Graphics and Computer-Aided Design

Cite this

Parkinson, M. B., Jensen, B. D., & Kurabayashl, K. (2001). Design of compliant force and displacement amplification micro-mechanisms. 741-748. Paper presented at 2001 ASME Design Engineering Technical Conference and Computers and Information in Engineering Conference, Pittsburgh, PA, United States.