As technology scales, interconnects have become a major performance bottleneck and a major source of power consumption for sub-micro integrated circuit (IC) chips. One promising option to mitigate the interconnect challenges is 3-D ICs, in which a stack of multiple device layers are put together on the same chip. In this paper, we explore the architectural design of cache memories using 3-D circuits. We present a delay and energy model 3-D cache delay-energy estimation tool (3D-Cacti) to explore different 3-D design options of partitioning a cache. The tool allows partitioning of a cache across different device layers at various levels of granularity. The tool has been validated by comparing its results with those obtained from circuit simulation of custom 3-D layouts. We also explore the effects of various cache partitioning parameters and 3-D technology parameters on delay and energy to demonstrate the utility of the tool.
|Original language||English (US)|
|Number of pages||12|
|Journal||IEEE Transactions on Very Large Scale Integration (VLSI) Systems|
|State||Published - Apr 1 2008|
All Science Journal Classification (ASJC) codes
- Hardware and Architecture
- Electrical and Electronic Engineering