Development of a low-temperature electro-mechanical testing device

A. L. Mbaruku, U. P. Trociewitz, Justin Schwartz

Research output: Contribution to journalArticle

5 Citations (Scopus)

Abstract

Understanding the strain-sensitivity of high temperature superconductors is important for the development of applications. Conductors for magnets experience mechanical loads during all stages of manufacturing and thermal cycling, as well as Lorentz force induced loads during operation. Thus, it is important to study the effects of mechanical loads on HTS conductors in the presence of magnetic field. Here we report on the development of a tensile testing device that was designed to characterize the in-field electromechanical behavior of HTS conductors. The device is capable of applying tension or compression, controlled fatigue cycles, and in-situ transport critical current measurements. We report on the development and capabilities of the device, as well as the initial stress-strain results at room temperature.

Original languageEnglish (US)
Pages (from-to)3620-3623
Number of pages4
JournalIEEE Transactions on Applied Superconductivity
Volume15
Issue number2 PART III
DOIs
StatePublished - Jun 1 2005

Fingerprint

Mechanical testing
conductors
Lorentz force
High temperature superconductors
Critical currents
Tensile testing
Thermal cycling
Electric current measurement
Magnets
cycles
Compaction
Fatigue of materials
Magnetic fields
high temperature superconductors
Temperature
critical current
magnets
manufacturing
sensitivity
room temperature

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Physics and Astronomy (miscellaneous)

Cite this

Mbaruku, A. L. ; Trociewitz, U. P. ; Schwartz, Justin. / Development of a low-temperature electro-mechanical testing device. In: IEEE Transactions on Applied Superconductivity. 2005 ; Vol. 15, No. 2 PART III. pp. 3620-3623.
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Development of a low-temperature electro-mechanical testing device. / Mbaruku, A. L.; Trociewitz, U. P.; Schwartz, Justin.

In: IEEE Transactions on Applied Superconductivity, Vol. 15, No. 2 PART III, 01.06.2005, p. 3620-3623.

Research output: Contribution to journalArticle

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