Development of high temperature capable piezoelectric sensors

Andrew D. Suprock, Bernhard R. Tittmann

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

The objective of the project was to investigate the influence of the temperature effect on ultrasonic transducers based on a comparison of the effects of high temperature conditions versus those of high temperature and irradiation on the transducer system. There was also a preliminary move towards the establishment of the means for optimizing the bulk single crystal transducer fabrication process in order to achieve peak efficiency and maximum effectiveness in both irradiated and non-irradiated high temperature applications. Optimization of the material components within the transducer will greatly increase non-destructive testing abilities for industry, structural health monitoring. Here is presented a progress report on the testing of several different piezoelectric materials under high temperature conditions. The viability of aluminum nitride (AlN) as a transducer material in high temperature conditions has been previously explored [1] and has been further tested to ensure reliability. Bistmuth Titanate (BiT) has also been tested and has displayed excellent effectiveness for high temperature application.

Original languageEnglish (US)
Title of host publication43rd Annual Review of Progress in Quantitative Nondestructive Evaluation, Volume 36
EditorsLeonard J. Bond, Dale E. Chimenti
PublisherAmerican Institute of Physics Inc.
ISBN (Electronic)9780735414747
DOIs
StatePublished - Feb 16 2017
Event43rd Annual Review of Progress in Quantitative Nondestructive Evaluation, QNDE 2016 - Atlanta, United States
Duration: Jul 17 2016Jul 22 2016

Publication series

NameAIP Conference Proceedings
Volume1806
ISSN (Print)0094-243X
ISSN (Electronic)1551-7616

Other

Other43rd Annual Review of Progress in Quantitative Nondestructive Evaluation, QNDE 2016
CountryUnited States
CityAtlanta
Period7/17/167/22/16

Fingerprint

transducers
sensors
structural health monitoring
aluminum nitrides
viability
temperature effects
ultrasonics
industries
fabrication
optimization
irradiation
single crystals

All Science Journal Classification (ASJC) codes

  • Physics and Astronomy(all)

Cite this

Suprock, A. D., & Tittmann, B. R. (2017). Development of high temperature capable piezoelectric sensors. In L. J. Bond, & D. E. Chimenti (Eds.), 43rd Annual Review of Progress in Quantitative Nondestructive Evaluation, Volume 36 [050007] (AIP Conference Proceedings; Vol. 1806). American Institute of Physics Inc.. https://doi.org/10.1063/1.4974601
Suprock, Andrew D. ; Tittmann, Bernhard R. / Development of high temperature capable piezoelectric sensors. 43rd Annual Review of Progress in Quantitative Nondestructive Evaluation, Volume 36. editor / Leonard J. Bond ; Dale E. Chimenti. American Institute of Physics Inc., 2017. (AIP Conference Proceedings).
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Suprock, AD & Tittmann, BR 2017, Development of high temperature capable piezoelectric sensors. in LJ Bond & DE Chimenti (eds), 43rd Annual Review of Progress in Quantitative Nondestructive Evaluation, Volume 36., 050007, AIP Conference Proceedings, vol. 1806, American Institute of Physics Inc., 43rd Annual Review of Progress in Quantitative Nondestructive Evaluation, QNDE 2016, Atlanta, United States, 7/17/16. https://doi.org/10.1063/1.4974601

Development of high temperature capable piezoelectric sensors. / Suprock, Andrew D.; Tittmann, Bernhard R.

43rd Annual Review of Progress in Quantitative Nondestructive Evaluation, Volume 36. ed. / Leonard J. Bond; Dale E. Chimenti. American Institute of Physics Inc., 2017. 050007 (AIP Conference Proceedings; Vol. 1806).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Suprock AD, Tittmann BR. Development of high temperature capable piezoelectric sensors. In Bond LJ, Chimenti DE, editors, 43rd Annual Review of Progress in Quantitative Nondestructive Evaluation, Volume 36. American Institute of Physics Inc. 2017. 050007. (AIP Conference Proceedings). https://doi.org/10.1063/1.4974601