Development of laser-based techniques for rapid prototyping of printed wiring boards

Nicholas Dellas, Brock Golesich, Kenneth Meinert, Suzanne Mohney

Research output: Contribution to conferencePaper

Abstract

For rapid prototyping and repair of printed wiring boards, direct laser patterning techniques of Cu are investigated. Laser direct writing techniques reported in the literature are compared and contrasted. The approach taken in this work is laser-induced Ag seeding of the substrate followed by subsequent electroless Cu plating. The Ag seeds were deposited on FR4 and Al 2O3 substrates using 3rd harmonic Nd:YVO 4 and CO2 laser beams. Laser-written Ag seeds were catalytic for electroless deposition of Cu. A minimum resistivity of 6 μΩ-cm was obtained.

Original languageEnglish (US)
StatePublished - Dec 1 2006
EventICALEO 2006 - 25th International Congress on Applications of Laser and Electro-Optics - Scottsdale, AZ, United States
Duration: Oct 30 2006Nov 2 2006

Other

OtherICALEO 2006 - 25th International Congress on Applications of Laser and Electro-Optics
CountryUnited States
CityScottsdale, AZ
Period10/30/0611/2/06

All Science Journal Classification (ASJC) codes

  • Geochemistry and Petrology
  • Electrical and Electronic Engineering

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  • Cite this

    Dellas, N., Golesich, B., Meinert, K., & Mohney, S. (2006). Development of laser-based techniques for rapid prototyping of printed wiring boards. Paper presented at ICALEO 2006 - 25th International Congress on Applications of Laser and Electro-Optics, Scottsdale, AZ, United States.