DG02-Wide-bandgap materials for future applications

Fernando Guarin, Alexander Grill, Mark Anders, Zakarie Chbili, Patrick Lenahan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

High Breakdown E field, high thermal conductivity, high carrier saturation velocity.

Original languageEnglish (US)
Title of host publication2020 IEEE International Integrated Reliability Workshop, IIRW 2020
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781728170589
DOIs
StatePublished - Oct 2020
Event2020 IEEE International Integrated Reliability Workshop, IIRW 2020 - Virtual, South Lake Tahoe, United States
Duration: Oct 4 2020Nov 1 2020

Publication series

NameIEEE International Integrated Reliability Workshop Final Report
Volume2020-October

Conference

Conference2020 IEEE International Integrated Reliability Workshop, IIRW 2020
CountryUnited States
CityVirtual, South Lake Tahoe
Period10/4/2011/1/20

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality
  • Electronic, Optical and Magnetic Materials

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