Dielectric Response and Charge Injection Behavior for Cu/PMMA/Pt and Cu/PMMA/n-Si

Cesar A. Nieves, Michael T. Lanagan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Metal - Insulator - Metal (MIM) and Metal - Insulator- Semiconductor (MIS) capacitors were fabricated by spin coating poly (methyl methacrylate) (PMMA) as the insulating material. Here, we consider the effect of dissimilar contact electrodes systems (Cu/Pt and Cu/n-Si) on the dielectric and electrical response. From the frequency- and temperature- dependent dielectric measurements, it was found that Cu/PMMA/n-Si interface has an additional contribution that affects the dielectric properties. Activation energies obtained from the ohmic conduction in forward bias showed a higher value in activation energy for Cu/PMMA/n-Si compared to that for Cu/PMMA/Pt, demonstrating the possible contribution of interfacial regions. Further experiments under reverse bias were carried out to study the importance of polarization in the electrical response.

Original languageEnglish (US)
Title of host publication2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2019 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages454-457
Number of pages4
ISBN (Electronic)9781728131214
DOIs
StatePublished - Oct 2019
Event2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2019 - Richland, United States
Duration: Oct 20 2019Oct 23 2019

Publication series

NameAnnual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP
Volume2019-October
ISSN (Print)0084-9162

Conference

Conference2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2019
CountryUnited States
CityRichland
Period10/20/1910/23/19

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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  • Cite this

    Nieves, C. A., & Lanagan, M. T. (2019). Dielectric Response and Charge Injection Behavior for Cu/PMMA/Pt and Cu/PMMA/n-Si. In 2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2019 - Proceedings (pp. 454-457). [9009650] (Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP; Vol. 2019-October). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/CEIDP47102.2019.9009650