Dielectrophoretic assembly and integration of nanowire devices with functional CMOS operating circuitry

S. Evoy, N. DiLello, V. Deshpande, A. Narayanan, H. Liu, M. Riegelman, B. R. Martin, B. Hailer, J. C. Bradley, W. Weiss, T. S. Mayer, Y. Gogotsi, H. H. Bau, T. E. Mallouk, S. Raman

Research output: Contribution to journalConference articlepeer-review

92 Scopus citations

Abstract

We present a novel platform for the development and deployment of nanosensors in integrated systems. The nanosensor technology is based on "striped" high aspect ratio cylindrical structures grown using porous membranes as templates. These nanostructures are manipulated using dielectrophoretic forces, allowing their individual assembly and characterization. This assembly also enables the development of "mixed-mode" integrated circuits that include readout, signal processing, and communications circuitry, as well as the requisite layout for the post-IC assembly of the nanostructures. We report on preliminary designs of such mixed mode systems whose layouts integrate dielectrophoretic assembly sites with a rudimentary resistance read-out circuitry.

Original languageEnglish (US)
Pages (from-to)31-42
Number of pages12
JournalMicroelectronic Engineering
Volume75
Issue number1
DOIs
StatePublished - Jul 2004
EventProceedings of the Symposium on Characterization - Phoenix, AZ, United States
Duration: Jun 17 2003Jun 20 2003

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

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