Diffusion bonding of bi-layered silver graphite-copper electrical contacts

Daudi R. Waryoba, Jeffery A. Johnson, Craig Stringer

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

Due to economic considerations, companies that produce electrical contacts are shifting from singlelayered to bi-layered electrical contacts. In this method, a thin layer of refractory based material (e.g. silver-graphite, silver-tungsten, silver-tungsten carbide) is bonded to a layer of pure copper (Cu) to create a bi-layered contact. Unfortunately, the traditional press, sinter, repress method has not been successful in producing bi-layered (clad) silver graphite (AgC)-Cu electrical contacts due to the presence of carbon (graphite) at the interface, as carbon is not diffusible into either silver or copper. This leaves a poor interface between the AgC section and the copper section decreasing the shear strength of the joint. This paper presents the results on the use of NiCr and Fe interlayers for diffusion bonding of bi-layered AgCCu electrical contacts.

Original languageEnglish (US)
Title of host publicationAdvances in Powder Metallurgy and Particulate Materials - 2014, Proceedings of the 2014 World Congress on Powder Metallurgy and Particulate Materials, PM 2014
PublisherMetal Powder Industries Federation
Pages936-945
Number of pages10
ISBN (Electronic)0985339764, 9780985339760
StatePublished - Jan 1 2014
Event2014 World Congress on Powder Metallurgy and Particulate Materials, PM 2014 - Orlando, United States
Duration: May 18 2014May 22 2014

Publication series

NameAdvances in Powder Metallurgy and Particulate Materials - 2014, Proceedings of the 2014 World Congress on Powder Metallurgy and Particulate Materials, PM 2014

Other

Other2014 World Congress on Powder Metallurgy and Particulate Materials, PM 2014
CountryUnited States
CityOrlando
Period5/18/145/22/14

All Science Journal Classification (ASJC) codes

  • Materials Chemistry
  • Metals and Alloys
  • Surfaces and Interfaces

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  • Cite this

    Waryoba, D. R., Johnson, J. A., & Stringer, C. (2014). Diffusion bonding of bi-layered silver graphite-copper electrical contacts. In Advances in Powder Metallurgy and Particulate Materials - 2014, Proceedings of the 2014 World Congress on Powder Metallurgy and Particulate Materials, PM 2014 (pp. 936-945). (Advances in Powder Metallurgy and Particulate Materials - 2014, Proceedings of the 2014 World Congress on Powder Metallurgy and Particulate Materials, PM 2014). Metal Powder Industries Federation.