Dissolution fundamentals of 193-nm methacrylate based photoresists

Ashwin Rao, Shuhui Kang, Bryan Vogt, Vivek M. Prabhu, Eric K. Lin, Wen Li Wu, Karen Turnquest, William D. Hinsberg

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Scopus citations

Abstract

The dissolution of partially deprotected chemically amplified photoresists is the final step in printing lithographic features. Since this process step can be tuned independently from the design of the photoresist chemistry, measurements of the dissolution behavior may provide needed insights towards improving line-edge roughness. We have studied the dissolution behavior of a model 193-nm photoresist, poly (methyladimantyl methacrylate), as a function of deprotection extent and developer strength. The kinetics of the dissolution process is followed using the quartz crystal microbalance technique. These photoresist films exhibit strong swelling without dissolution over a significant range of deprotection levels. At larger extents of deprotection, we observe a combination of swelling with dissolution. Additionally, we find that the degree of film swelling decreases with tetramethylammonium hydroxide developer concentration. These studies provide the insight needed to better understand the fundamentals of the dissolution of the photoresist - a key step in lithographic process.

Original languageEnglish (US)
Title of host publicationAdvances in Resist Technology and Processing XXIII
DOIs
StatePublished - Jul 10 2006
EventAdvances in Resist Technology and Processing XXIII - San JOse, CA, United States
Duration: Feb 20 2006Feb 22 2006

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume6153 I
ISSN (Print)0277-786X

Conference

ConferenceAdvances in Resist Technology and Processing XXIII
CountryUnited States
CitySan JOse, CA
Period2/20/062/22/06

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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