Effect of differential shrinkage on microstructural development in LTCC multilayer substrates

W. S. Hackenberger, Thomas R. Shrout, J. P. Dougherty, R. F. Speyer

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The microstructural development of a multilayer substrate during co-firing was investigated using a combination of Environmental Scanning Electron Microscopy and sinter/quenching experiments. The multilayer samples were composed of a low temperature co-fireable ceramic substrate with buried silver thick films. At low heating rates the film was found to delaminate from the substrate during initial stage sintering of the silver. This delamination was healed as soon as the film's glass frit softened and flowed to the substrate and no further damage occurred. For heating rates greater than 25°C/min delamination occurred above 800°C and was facilitated by porosity at the film/substrate interface. This porosity was due to residual gases from the binder burnout process.

Original languageEnglish (US)
Title of host publicationInternational SAMPE Electronics Conference
PublisherSAMPE
Pages643-650
Number of pages8
Volume7
StatePublished - 1994
EventProceedings of the 1994 7th International SAMPE Electronics Conference - Parsippany, NJ, USA
Duration: Jun 20 1994Jun 23 1994

Other

OtherProceedings of the 1994 7th International SAMPE Electronics Conference
CityParsippany, NJ, USA
Period6/20/946/23/94

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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