Effect of droplet spacing & deposition height on Sn conductive lines by pneumatic diaphragm drop-on-demand technology

Chunxi Wang, Daokun Liao, Sheng Liu, Xiaotian Li, Honghai Zhang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Scopus citations

Abstract

Pneumatic diaphragm drop-on-demand (DOD) Technology is an attractive method for Sn conductive lines owing to low-cost, low-waste, and simple process. Based on stable generation of Sn droplets, the process parameters such as droplet spacing and deposition height have significant effect on the final quality of Sn conductive lines. In this work, Sn conductive lines were generated while droplet spacing was between 0.5mm and 2.2mm and deposition height was between 20mm and 38mm. The result suggested that proper droplet spacing and small deposition height would get high quality Sn conductive lines.

Original languageEnglish (US)
Title of host publication2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016
EditorsKeyun Bi, Sheng Liu, Shengjun Zhou
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1512-1516
Number of pages5
ISBN (Electronic)9781509013968
DOIs
StatePublished - Oct 4 2016
Event17th International Conference on Electronic Packaging Technology, ICEPT 2016 - Wuhan, China
Duration: Aug 16 2016Aug 19 2016

Publication series

Name2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016

Conference

Conference17th International Conference on Electronic Packaging Technology, ICEPT 2016
CountryChina
CityWuhan
Period8/16/168/19/16

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering
  • Mechanics of Materials

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    Wang, C., Liao, D., Liu, S., Li, X., & Zhang, H. (2016). Effect of droplet spacing & deposition height on Sn conductive lines by pneumatic diaphragm drop-on-demand technology. In K. Bi, S. Liu, & S. Zhou (Eds.), 2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016 (pp. 1512-1516). [7583410] (2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICEPT.2016.7583410