Effect of electromechanical coupling on the young's modulus of zinc oxide nanowires

A. V. Desai, Md Amanul Haque

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The Young's modulus of zinc oxide nanowires was measured to be significantly lower than bulk zinc oxide, which cannot be explained within the framework of existing theories. We propose that the strong electromechanical coupling in piezoelectric materials, such as zinc oxide, influences the measured mechanical properties. The asymmetric wurtzite crystal structure and the ionic nature of the molecular bonding result in internal electric fields during straining of the zinc oxide nanowire, which in turn lead to reduction in the measured modulus. In case of flexural deformation, additional electromechanical coupling is present due to the flexoelectric effect.

Original languageEnglish (US)
Title of host publicationASME 2008 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2008
Pages553-559
Number of pages7
DOIs
StatePublished - Dec 1 2008
EventASME 2008 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2008 - Brooklyn, NY, United States
Duration: Aug 3 2008Aug 6 2008

Publication series

NameProceedings of the ASME Design Engineering Technical Conference
Volume4

Other

OtherASME 2008 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2008
CountryUnited States
CityBrooklyn, NY
Period8/3/088/6/08

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All Science Journal Classification (ASJC) codes

  • Modeling and Simulation
  • Mechanical Engineering
  • Computer Science Applications
  • Computer Graphics and Computer-Aided Design

Cite this

Desai, A. V., & Haque, M. A. (2008). Effect of electromechanical coupling on the young's modulus of zinc oxide nanowires. In ASME 2008 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2008 (pp. 553-559). (Proceedings of the ASME Design Engineering Technical Conference; Vol. 4). https://doi.org/10.1115/DETC2008-49911